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Stupid cooling method came to me in a dream

post #1 of 7
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So I had a dream (been sleeping a lot, sick lately) about an ATX case shaped like a addition symbol. The motherboard would stretch from one side to the other, so there would be a gap under the mobo, which should be right under the CPU. Then in the gap would be a fan set to intake, blowing directly under the CPU and the RAM. Then you could just add more fans to the other ends of the case, so you can have 2 intakes, 2 outtakes.
post #2 of 7
Wouldn't the mobo be blocking the bottom of the "plus sign" in terms of airflow? Also the bottom of the motherboard doesn't require cooling in really any circumstance.
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post #3 of 7
Thread Starter 
Quote:
Originally Posted by alcal View Post

Wouldn't the mobo be blocking the bottom of the "plus sign" in terms of airflow? Also the bottom of the motherboard doesn't require cooling in really any circumstance.

Idk if it would really block it or not, that's not really the point. The point is it *should* "cool" the part of the motherboard that gets warm from the CPU. Obviously it's not required, it's just some stupid/interesting idea I had.
post #4 of 7
Cooling the back of a motherboard does help. Not very much if the rest of your cooling setup is adequate, but it is still something.

A plus shape however would be an incredibly inefficient way to cool a system though (as well as being footprint inefficient, etc.) You will be creating a ton of turbulence in areas that aren't helpful, and likely also cause an airflow loop.

A better solution would be a tunnel, with all the components positioned so that they are parallel to one another, and perpendicular to the length of the tunnel. Slap ribbed finned heatsinks on everything, parallel to the length of the tunnel. Put a very strong fan on one end as an intake and on the other as an exhaust. All components get cooled on both front and back. All airflow is along a single path, with turbulence only occurring at the hardware contact points (exactly where you want it to pick up heat), no chance of an airflow loop.

If you were willing to make the thing extra loud for the sake of extra cooling, you could also make the ends of the tunnel (where the fans are) wider than the middle (where all the components are). Not only will this allow you to use much larger fans that push more air, but the compression in the middle will actually cause the air to cool down below ambient room temperature. As it decompresses on the other end, it will return to normal room temperature (and then some because of the heat it picked up off the components), but by then it doesn't matter, as it has already served its purpose as a cooling agent. You would need some serious static pressure on those fans though, and a real nice smooth taper, at least on the intake side.
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post #5 of 7
Actually cooling the back of the motherboard is a very good idea. This pic shows the VRMs at 43C while idling. When stress testing, when they hit 82C they could no longer carry the load and the overclock failed.


Active cooling of the back side of the motherboard is very common these days and is one reason for the popularity of extra wide cases.

Yes! It is best to think of your case as a wind tunnel with some electrical stuff in it when designing your cooling system.
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post #6 of 7
The idea reminds me of BTX form factor, where the CPU fan sucks air directly from the front and blows it into cooling fins mounted very close to the motherboard. Then the exhaust from the CPU cooler is supposed to also cool the chipset etc.

If I would brainstorm/fantasize a motherboard layout, it would have the CPU with low heat sink on one side and the other components on the other. Then use a single fan to supply the air from below.
post #7 of 7
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