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Thermal compound.

post #1 of 2
Thread Starter 
I'm certain this has been talked about many times. I'm looking for the best straight forward answer I can get. I know GPU dies are much different when it comes to heat spreaders. Do I apply the same type of knowledge from CPUs to GPUs ?
I prefer shin etsu, is this what is used from factory like on corsair products ? Also I can't find a straight answer. Do I apply small pea method, grain of rice, thin layer, an x, or a cross ? Hard to say, but I'm sure now that I will be testing new AMD cards like rx 470, and gtx 1070s I would like proper information. Mostly for review I will be taking off head sinks to show pcb's, so I will need to reapply alot.
Test Bench
(13 items)
 
  
CPUMotherboardGraphicsRAM
6700k ASUS ROG STRIX Z270G Nvidia GTX 1060 Corsair Vengeance LPX 16GB DDR4 DRAM 3000MHz 
Hard DriveCoolingOSMonitor
MyDigital BPX CoolerMaster Master Liquid 240 windows 10 x64 pro Viewsonic xg2703-gs 
KeyboardPowerCaseMouse
Logiech G413 Corsair rm650x Test Bench Logitech G403 
Audio
Logitech G533 
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Test Bench
(13 items)
 
  
CPUMotherboardGraphicsRAM
6700k ASUS ROG STRIX Z270G Nvidia GTX 1060 Corsair Vengeance LPX 16GB DDR4 DRAM 3000MHz 
Hard DriveCoolingOSMonitor
MyDigital BPX CoolerMaster Master Liquid 240 windows 10 x64 pro Viewsonic xg2703-gs 
KeyboardPowerCaseMouse
Logiech G413 Corsair rm650x Test Bench Logitech G403 
Audio
Logitech G533 
  hide details  
Reply
post #2 of 2
https://www.youtube.com/watch?v=EyXLu1Ms-q4

Personally I like the small pea (dot) method. I think you can just run with pretty much the same rules as for a CPU. Probably the cross method may be best to get enough coverage, as i think GPU dies tend to be bigger.Just don't overdo it with the compound, I've used to much on a CPU in the past, and it actually increased the temps, as the heatsink didn't contact the metal heatspreader due to all the paste. remember its just to fill the small gaps. smile.gif
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