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New Case Company - What do you want to see in a new case? - Page 2

Poll Results: Which form factor first?

 
  • 37% (19)
    ATX Full
  • 25% (13)
    ATX Mid
  • 17% (9)
    m-ATX
  • 15% (8)
    ITX
  • 3% (2)
    Cube?
51 Total Votes  
post #11 of 36
Thread Starter 
Quote:
Originally Posted by FireOath View Post

I have always been a mid tower kinda guy so I went with that.

Good luck!

Thanks!

Quote:
Originally Posted by HZCH View Post

Voted the itx form factor because I started with it and wouldn't ever have a bigger case than a mATX form factor... But yes, as others have suggested, if you can, try to propose two form factor cases... I think an ATX and a mATX will answer some needs, but on the other side, a radical itx approach might give you a name even if it's not a best-seller...

My two eurocents 😁

Awesome, thanks for the vote. It's interesting seeing the different interest from the few forums that I posted this thread on specifically. I would love to do two form factors but it will come down to cost of prototypes and production and such. My plan atm is to get the first design ironed out, create a second design in a different form factor, and take the first one to kickstarter for capital to be used for professional prototyping purposes. That being said, the second design may be something that is placed as a stretch goal part of the kickstarter to also get a professional prototype done for the second design. Assuming that hits, I would do the same for either another campaign for production runs, or just get as much feedback as possible in how many people would buy which if they hit the market before using other funding to get both into production.
Quote:
Originally Posted by Duality92 View Post

Right now the market is so saturated with cases you need to do something new. With that said, study the case market, look at sites like pc part picker and check the ones with the most ratings, check forums case club threads and such things. You'll quickly see that the market is big. I personally own 17 cases and have 3 scratch built in my workshop along with 3-4 designs I've never done.

Ask @Jeffinslaw for tips, he might be a good ressource for this.


I plan to do a handful of things differently. Granted, they won't be life altering, but they will stand out from everything that I have seen. I've been watching cases for a very very long time and have watched just about every case review from every major reviewer on youtube to see their loves/hates with the cases they review for obvious reasons. I understand its pretty saturated, but there is a HUGE gap between the good cases and case companies, the ones that simply exist. I could count on one hand the companies that I would ever buy a case from, and, for the most part, I would not consider Lian Li and some others of that caliber in the same market because I don't plan on making any cases $1500 or anything remotely close to that. I do really appreciate the input and I will reach out to @Jeffinslaw and see if he has any tips for me.
post #12 of 36
Thread Starter 
@BA Tech: as others have said, make something that stands out, as there's a lot of standard atx case out there...
Then I can't help you. Maybe look in your region or in China if someone can prototype and/or produce your ideas?[/quote]

Hadn't replied to this one, whoops. That may be an option for production, but it is not something I would do with just a CAD design selling or licensing it to them to produce, I want full ownership of the design and the sales/marketing etc. Think of Ncase - designed by their team, sold by their team, manufactured by Lian Li. That is definitely something I would consider doing as we move further down this road.
post #13 of 36
Thread Starter 
bump - if anyone has input specifically on the front panel of the case please feel free to share. Trying to narrow down the design of that portion as my CAD designer plans to start on Monday.
post #14 of 36
The InWin 303, upside down, a little wider, 140mm fan support, built in water cooling pass throughs (fill and drain) and much better cable cut outs would be just about perfect.

I would also like to see a case that actually channels airflow. L tunnels, venturi tunnels, different chambers for certain components. Basically where no fan/rad exhausts hot air into a component and no component dumps hot air into a rad/fan. Something very purposeful and engineered vs a "design exercise". Very few cases focus on thermals in a way other than more vents!

Also having watched a Parvum case get assembled, I would have no problem assembling a case that was well designed (and came with good instructions).

I should also state that I went with a mid tower because often I find ITX to be too hard to work in, mATX to offer poor mobo support (to my tastes), and full towers are just too damn big. I do think there needs to be more mid towers with genuine EATX mobo support. Phanteks Enthoo Evolv ATX could have been 1 inch longer...
Edited by paskowitz - 8/4/16 at 8:44pm
    
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post #15 of 36
Thread Starter 
Quote:
Originally Posted by paskowitz View Post

The InWin 303, upside down, a little wider, 140mm fan support, built in water cooling pass throughs (fill and drain) and much better cable cut outs would be just about perfect.

I would also like to see a case that actually channels airflow. L tunnels, venturi tunnels, different chambers for certain components. Basically where no fan/rad exhausts hot air into a component and no component dumps hot air into a rad/fan. Something very purposeful and engineered vs a "design exercise". Very few cases focus on thermals in a way other than more vents!

Also have watched a Parvum case get assembled, I would have o problem assembling a case that was well designed (and came with good instructions).

Awesome thanks for your input. That is something that I am definitely doing my best to be conscious of without going over the top and making it ugly in exchange for only thermals. Working to find a good middle ground. For the most part I think some issues with dumping hot air into another component is due to poor fan management. There are many thermal issues with cases that can be fixed with proper use on the user end, but I do know there are some cases with just poor thermals. For instance, I know that the thermals on an H440 are okay at best, but not at all great. The front panel is the most important to find a solution for sleek design while improving airflow imo. The rear and top panels being nearly full mesh is as good as it will get imo. Looking at the 303 the only thing that is not optimal is the 360rad blowing into the intake of the PSU. That is one of those instances you spoke of. Without getting down to specific pros/cons of multiple cases, our goal is to create a well designed case with beautiful aesthetics as well as airflow. Nobody wants an ugly case with good airflow and nobody wants an incredible looking case with bad airflow of course.

Thanks again for the input, which form factor case did you vote for?
post #16 of 36
Aluminum! Easily accessible filters and a fan ventilation design that isn't too restrictive like the Corsair 750D and Phanteks Enthoo Evolv are.
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post #17 of 36
Voted mATX. And since I'm on the look out for a new one, it surprised me that most cases have; more outtake than intake (shouldn't it be the other way around!?) and still have 5.25 bay's (why?). I'd personally like too see all vent holes open (caselabs style), covert with a simple mesh design. Also PSU placecement can be crucial for the overall design. Another thing might be the io panel placement; user-friendliness, but those are just details. Best of luck with your endeavour. thumb.gif
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post #18 of 36
Personally I am still waiting for NZXT Switch 810 replacement. I want something like that but 480 support at the top. Most cases right now only fit thin RADs and to have more then 1 RAD you have to sacrifice storage space. Aluminum is a waste of money. The cost will go too high for people to consider.
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post #19 of 36
Thread Starter 
Quote:
Originally Posted by boredgunner View Post

Aluminum! Easily accessible filters and a fan ventilation design that isn't too restrictive like the Corsair 750D and Phanteks Enthoo Evolv are.

Quote:
Originally Posted by zenn84 View Post

Voted mATX. And since I'm on the look out for a new one, it surprised me that most cases have; more outtake than intake (shouldn't it be the other way around!?) and still have 5.25 bay's (why?). I'd personally like too see all vent holes open (caselabs style), covert with a simple mesh design. Also PSU placecement can be crucial for the overall design. Another thing might be the io panel placement; user-friendliness, but those are just details. Best of luck with your endeavour. thumb.gif

Quote:
Originally Posted by ZealotKi11er View Post

Personally I am still waiting for NZXT Switch 810 replacement. I want something like that but 480 support at the top. Most cases right now only fit thin RADs and to have more then 1 RAD you have to sacrifice storage space. Aluminum is a waste of money. The cost will go too high for people to consider.

Gunner, Aluminum is the plan atm unless costs get too high, but I don't really see that happening. Plenty of cases now are made almost completely out of aluminum without being too pricey to use like the 750D etc. If it does get to pricey the only thing that would change would be the front panel becoming plastic but again don't see that needing to be the case (punny aye?) < sorry I'm that way. lol thanks for the input.

Zenn - interesting vote sir. I agree with you that it seems wrong, but there aren't too many other options unless you are getting a cube. The whole fan in the side panel thing is long gone and was ugly to begin with imo, and other than that it is up to the builder to decide if they for some reason want a top intake. The other option there is to have optional intake from the bottom near the front half to add to the intake at the front (not a huge increase in cooling, but not completely insignificant). Yes 5.25" bays are a joke now lol. I also love caselabs design for their mesh fan areas and will look to make something extremely similar as I think that the design makes it stand out much less than the regular hole design in something like the 750D airflow front. IO placement is another thing I have been considering greatly actually and think I am going with a vertical placement on the top of the case for a few reasons that will be listed in the first CAD prototype posting for people to respond to. Thanks a bunch for your input.

Zealot - 480 support at the top is something I would love to have in this case but I don't think I will be going for the super large full tower version immediately, but always good to know some other directions for a second case design. I think the aluminum situation is just that, very situational, but is something I am of course considering and will know once it comes time to talking with the manufacturers I have plans to contact for production. thanks for responding, every bit of input is appreciated.
post #20 of 36
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