post #41 of 41
Quote:
Originally Posted by Defoler View Post

My main issue with this is that you compared HBM2 to GDDR5 instead of GDDR5X.
While GDDR5 is old and does consume a lot of power, GDDR5X is a lot more efficient for the GPU core, and while it does not have the power efficiency of HBM2, it is still not sitting on top of the core.

If you talked about the nano, it was much worse in terms of performance/watt compared to the 980, while being just a few % faster in the overall.

Even if the HBM2 is taking lets say 50W TDP less in the overall, it is still putting the rest of the TDP on the core, which the GDDR5x is "offloading" them to another area of the card, which makes it easier to disperse the heat vs a one stronger hot plate which might require under clocking the GPU even more if it has to be put in a small bundled area like a laptop or even a tablet.

HBM3 might help with that, but it is going to take time to move to it, so right now, it is not a solution.

Hmm...

One small disagreement. Why do heatsinks grow in surface area? Why do heatsinks add fins, ridges, bumps etc in order to increase surface area?

GPUs are quite tiny, adding HBM to the mix increases the surface area and thus contact area with the GPU cooler. I think that this makes it easier, not harder, to cool.

Just a thought.
Quote:
The new design is referred to as a 2.5D package as it has some vertical stacking but isn't a truly 3D package with DRAM atop GPU. This has some interesting implications for cooling. Physically, the DRAM stacks and GPU are at approximately the same height, but the package will be topped by a flat heatspreader with thermal contact material between it, the memory and the GPU. In this way, AMD says, the high-bandwidth memory acts as a heatsink for the GPU, adding surface area to the overall solution – cooling was actually less of a challenge than they originally thought. Still, if the TDP of the new cards is in line with the R9 290-series, let's hope AMD has developed a superior reference cooler or has third-party models ready on day one.
http://www.bit-tech.net/hardware/memory/2015/05/19/an-overview-of-high-bandwidth-memory-hbm/2
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