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Has anyone had the cojones to try coollabratories liquid pro on a fiji chip?

post #1 of 2
Thread Starter 
Seeing as how liquid pro is what it is, and how it practically soaks into metal, I'm reluctant to get a fancy new fiji board and swap the thermal goop out for liquid pro. I've been using liquid pro for about 2 years now, and I've always had great results, but I've never used it on a direct chip die, or on HBM.

HBM on its own makes me nervous, the papers I've read on it make it seem like it can be crushed with a little downward force, but maybe they're more robust than that - I don't recall reading anything that indicates one way or the other. Could the liquid pro possibly get in between the layers on HBM and totally gunk up the works?

I need to squeeze an R9 Nano into a relatively tight case, but I may be able to pipe cool air in so I want to enhance conductivity as much as I can between the gpu and heatsink.

Thoughts?
post #2 of 2
Thread Starter 
For anyone else looking into this, I found this article on Semi-Accurate:

http://semiaccurate.com/2015/06/22/amd-talks-fiji-fiji-x-odd-bits-tech/

It basically says that the interposer that connects the fiji to the hbm is an upside-down chip itself, so all of the fragile bits are exposed. This likely means a single misstep with any conductive compound means sudden death. It sounds like it's less of an issue of the HBM being fragile and more an issue of the exposed interposer.

Come to think of it, by contrast, Nvidia's P100 chip looks like the epoxy'd the thing up pretty well, so this exact thing wouldn't be a concern.

As MX-4 is non-conductive, I guess it might be ok? I'm not brave enough to risk a card this expensive though.
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