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[TH]Intel Kaby Lake: 14nm+, Higher Clocks, New Media Engine - Page 6

post #51 of 75
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what insult? is the word satisfactory an insult now?
You know how to ask snideful rhetorical questions, but would ask me afterwards to explain what you did?
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if you don't wanna read the other posts then just say so.
I read all the posts, I said there was no clear line of argument as you had implied.
post #52 of 75
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Originally Posted by Popple View Post

I read all the posts, I said there was no clear line of argument as you had implied.

there are, i don't know how you missed every single posts regarding CPU SKUs without the GPU included.
post #53 of 75
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Originally Posted by epic1337 View Post

there are, i don't know how you missed every single posts regarding CPU SKUs without the GPU included.

The 'posts' themselves come from may different people making different points. Me reading them has nothing to do with your particular line of argument.

And to my knowledge the theme from your end was to get Intel to make CPUs without igpus. The post of yours I responded to was then talking about removing components that were on that diagram.

All of your responses so far have been accusations against me, not clarifying your own message.
post #54 of 75
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Originally Posted by Popple View Post

And to my knowledge the theme from your end was to get Intel to make CPUs without igpus. The post of yours I responded to was then talking about removing components that were on that diagram.
how are these two points not related? you get the same rough configuration without the GPU, thus an ample example of what to expect.
post #55 of 75
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how are these two points not related? you get the same rough configuration without the GPU, thus an ample example of what to expect.

They either would have to produce a cpu with the others, with the igpu, and then cut it out, or they would have to create a different, separate design.

The first option would not make any sense, hence my first question mark response.
post #56 of 75
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Originally Posted by Popple View Post

They either would have to build a cpu with the igpu and then cut it out, or they would have to create a different, separate design.

The first option would not make any sense, hence my first question mark response.
the latter, hence why my very first post is implying a new "SKU".


umm they're already making those, although not physically removing them, saying "it doesn't make any sense" is very ironic.
post #57 of 75
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the latter, hence why my very first post is implying a new "SKU".
I thought that had already been replied to by others, and you were accusing me of not following the thread.
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umm, they're already making those, saying "it doesn't make any sense" is very ironic.
You mean ones with faulty igpus? Those are defects by chance, not through intention. Their availability at any particular time can not be guaranteed.
post #58 of 75
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Originally Posted by Popple View Post

You mean ones with faulty igpus? Those are defects by chance, not through intention. Their availability at any particular time can not be guaranteed.

no they actually do make those to some extent, otherwise with the improving yields there would be less supply at hand.
post #59 of 75
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Originally Posted by epic1337 View Post

at least on skylake, they no longer use their S-GT2 SKUs for their mobile chips, they only use Y-GT2, U-GT3e, and H-GT4e SKUs.

Both Intel's pre-launch slides and the newest revisions of current mobile datasheets directly contradict this.

Unless you can show me an image of the CPU from what is unambiguously an HD 530 equipped part that shows the larger 4+4 die, I'm going to be highly skeptical of the use of such parts in non-Iris Pro SKUs.
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Originally Posted by epic1337 View Post

otherwise, it'd be quite unusual for an i7 mobile chip with HD530 to be priced so close to an i7 mobile chip with Iris Pro.

Market positioning is the dominant factor when it comes to pricing, not die size.
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Originally Posted by epic1337 View Post

the post above mine?

That wasn't my interpretation of his statement.

Smaller dies are cheaper to make, but the fewer die flavors you need to cover all segments the less overhead you have. The market for IGPless parts is likely not large enough to recoup the relatively small cost savings.

It would be far more wasteful to use the 4+4e dies for HD 530 parts than to make a separate line of 4+0 dies for the small number of parts that could be sold with no IGP.
Quote:
Originally Posted by SpeedyVT View Post

Higher clocks makes me think Intel is going the way of the bulldozer.

The architecture is virtually identical, just refined. That's exactly the opposite of Bulldozer or Netburst, which were radical departures from what came before them, with substantial changes to everything in pursuit of higher clocks.
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post #60 of 75
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Originally Posted by Blameless View Post

Smaller dies are cheaper to make, but the fewer die flavors you need to cover all segments the less overhead you have. The market for IGPless parts is likely not large enough to recoup the relatively small cost savings.

It would be far more wasteful to use the 4+4e dies for HD 530 parts than to make a separate line of 4+0 dies for the small number of parts that could be sold with no IGP.

they've got dozens of SKUs if you include the E7, E5 and EX chips, whats one more SKU on the table really? i don't think its literally "hundred millions of USD" per additional SKU.

wait, are you expecting that every 4+4e dies are a perfect whole? my hypothesis is that defective 4+4e dies are cutdown to 4+2 and further without the eDRAM.
the absence of 4+3e further confirms this hypothesis, unless they aren't binning defective 4+4e dies entirely.
Edited by epic1337 - 8/30/16 at 11:44pm
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