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[Wccftech] First Intel Core i7-7700k Benchmarks Are Out - Page 17

post #161 of 221
Quote:
Originally Posted by Nightingale View Post

that's a matter of perspective. I have 3 old GPU's just sitting around that can be used if my current GPU dies, or If I need to RMA and have a functional computer. No doubt IGPU can be a convenience for some but never in 5 years have I ever used the IGPU in my CPU. the IGPU took a massive amount of die space up from sandybridge on forward.

Just take a look @ the current Skylake 4 Core CPU and how much of that space could have been used for cores, seeing as the IGPU takes up half the size of the die. I would imagine most PC gamer's or any enthusiast would take cores over the IGPU.

iGPU is such a waste for most of us here. (read minority) In practice I've only turned it on once when I built my computer prior to my Titan X's showing up. So at least I had a working PC. To me it's just a near useless Maintenance mode.

 

I'd love to have that die space as something usefull for me now. Next time I'll bite the bullet and get one of the performance CPU's with no iGPU.

post #162 of 221
Quote:
Originally Posted by Ghoxt View Post

iGPU is such a waste for most of us here. (read minority) In practice I've only turned it on once when I built my computer prior to my Titan X's showing up. So at least I had a working PC. To me it's just a near useless Maintenance mode.

I'd love to have that die space as something usefull for me now. Next time I'll bite the bullet and get one of the performance CPU's with no iGPU.


Which one of performance CPU's?
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post #163 of 221
The one with M.O.A.R cores wink.gif
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post #164 of 221
Quote:
Originally Posted by Ghoxt View Post

iGPU is such a waste for most of us here. (read minority) In practice I've only turned it on once when I built my computer prior to my Titan X's showing up. So at least I had a working PC. To me it's just a near useless Maintenance mode.

I'd love to have that die space as something usefull for me now. Next time I'll bite the bullet and get one of the performance CPU's with no iGPU.

useful to flash if brick smile.gif
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post #165 of 221
Quote:
Originally Posted by Blameless View Post


A desktop i5 or i7 has the same die found in the H series mobile chips, while desktop i3s and Pentiums use the same die found in the U and Y mobile parts...again, excepting the ones with the larger IGPs and eDRAM. They are generally packaged differently, but the CPU dies are the same.

Really?  Ok, I always take what you say as truth so iv learned something new today haha.  Thanks! :cheers:

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post #166 of 221
Quote:
Originally Posted by Dragonsyph View Post

Really?  Ok, I always take what you say as truth so iv learned something new today haha.  Thanks! cheers.gif

Yeah. In general, the fewer types of something they have to make the better. Far easier to sort the 2+2 (core/GPU config) and 4+2 dies that are used for mainstream desktop parts and most non-Iris Pro mobile parts, by leakage and power consumption, then package them as necessary, rather than have two extra designs.

Also, no one is infallible, so don't be afraid to call me out on something if you've got reason to believe I'm mistaken.
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post #167 of 221
Quote:
Originally Posted by Blameless View Post


Yeah. In general, the fewer types of something they have to make the better. Far easier to sort the 2+2 (core/GPU config) and 4+2 dies that are used for mainstream desktop parts and most non-Iris Pro mobile parts, by leakage and power consumption, then package them as necessary, rather than have two extra designs.

Also, no one is infallible, so don't be afraid to call me out on something if you've got reason to believe I'm mistaken.

That makes sense, i think the reason i thought they were different was looking at the chips them selfs.  Mobile chips look weird to me haha. 

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post #168 of 221
Yeah they have as many packages as dies, so you have to look at the die itself to see where they came from.

Here is an example:

002.jpg

Leftmost is the BGA 1356 package with a 2+3e die configuration plus the platfom I/O. Second from left is also BGA 1356, but this time a 2+2 die configuration also with the platform I/O, but no eDRAM die this time. Third from left is BGA 1440 4+2 die configuration; no eDRAM and no platform I/O because it connects to an off-package chipset. Rightmost part is a desktop LGA-1151 package, which could use either the 2+2, or the 4+2 die.

If we assume that desktop chip is a quad core (either a Skylake i5 or i7), it's die would look the same as the mobile BGA 1440 4+2 die. Indeed, the dies could have been cut from the very same wafer, but wound up in different parts due to clock or power properties, or possibly by pure chance (if both dies were good enough to qualify for both parts).
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post #169 of 221
Quote:
Originally Posted by Blameless View Post

Yeah they have as many packages as dies, so you have to look at the die itself to see where they came from.

Here is an example:

002.jpg

Leftmost is the BGA 1356 package with a 2+3e die configuration plus the platfom I/O. Second from left is also BGA 1356, but this time a 2+2 die configuration also with the platform I/O, but no eDRAM die this time. Third from left is BGA 1440 4+2 die configuration; no eDRAM and no platform I/O because it connects to an off-package chipset. Rightmost part is a desktop LGA-1151 package, which could use either the 2+2, or the 4+2 die.

If we assume that desktop chip is a quad core (either a Skylake i5 or i7), it's die would look the same as the mobile BGA 1440 4+2 die. Indeed, the dies could have been cut from the very same wafer, but wound up in different parts due to clock or power properties, or possibly by pure chance (if both dies were good enough to qualify for both parts).

Thanks for that info, helps me understand it more.  And I'm guessing the desktop ones have the IHS plates for more cooling?

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post #170 of 221
Quote:
Originally Posted by Benny89 View Post

On the other hand- Have any one saw/read any leaks when 200-series motherboards is supposed to hit market? Shouldn't be same time as Kaby or little earlier?

The ideal logic would be to rush the release of 200 series motherboards in October that is right now. Kaby lake CPUs to be released early next year. I would definitely jump on it. My current motherboard Asus Z170 VIII Maximus Ranger has trouble to run XMP RAM above 2700 Mhz.

But there is simply no info about the new motherboards. I have a new build in the works. All components have arrived. Just waitig for 200 series so that I can slap a i5 6500 on it since there are not great IPC improvements.
Edited by d5aqoep - 10/4/16 at 9:13pm
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