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Kaby Lake Overclocking Guide [With Statistics] - Page 184

post #1831 of 2724
Quote:
Originally Posted by Inelastic View Post

I haven't changed mine. I run at 4.8GHz at 1.21V Vcore set in the bios (1.165V under load) on a custom loop and get in the low 60s in RealBench. At 5GHz, I was at 1.35V set in the bios and 1.312V under load running at mid 80s in RealBench.

What the hell. I'm so envious. Then again the custom loop may be the factor here, but over 1.32v with stock TIM my CPU would hit 100C even with my D14 running full blast.

I suppose if I re-de-lid and apply less RTV or just use 4 dots of superglue as Rockit suggests, I could probably get another 3-5C out of the drop. In my years of OCing I've never gotten a lucky chip. Oh well.
post #1832 of 2724
Quote:
Originally Posted by becks View Post


Have you seen my latest update ? quoted here.. It was me being silly all along rolleyes.gif

lol... good to know you got it sorted out. thumb.gif
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post #1833 of 2724
Quote:
Originally Posted by dmo580 View Post

What the hell. I'm so envious. Then again the custom loop may be the factor here, but over 1.32v with stock TIM my CPU would hit 100C even with my D14 running full blast.

I suppose if I re-de-lid and apply less RTV or just use 4 dots of superglue as Rockit suggests, I could probably get another 3-5C out of the drop. In my years of OCing I've never gotten a lucky chip. Oh well.
I would not use superglue....
post #1834 of 2724
Re-lid? Why, just run it naked, what's the point of delidding otherwise if you just change the TIM, sure helps but worth the trouble, nah.
post #1835 of 2724
Quote:
Originally Posted by JackCY View Post

Re-lid? Why, just run it naked, what's the point of delidding otherwise if you just change the TIM, sure helps but worth the trouble, nah.

Running naked has its own risks too with the thin PCB. The theory is both the TIM and gap that Intel introduced is causing the massive temperature spike. That is why just by delidding, applying new TIM and reducing that gap between the die and IHS can see anywhere from 10-25C drops.

I have no idea how I did as it was my first time, but after reading a bit more, it seems that taking it back off just to observe the imprint the die made would be a good inspection. Also, in reviewing my own work with the RTV it's clear I used too much even though I used a needle and syringe. I probably should've just brushed small amounts of RTV on there--enough so I don't need to worry about IHS movement.
post #1836 of 2724
Quote:
Originally Posted by MaKeN View Post

I would not use superglue....

I wouldn't glue the IHS down with 4 lines of super glue as that would be pretty much perament, but is 4 dots in the corners on the outside that bad? (Photo below from Rockit Cool)

post #1837 of 2724
Quote:
Originally Posted by dmo580 View Post

I wouldn't glue the IHS down with 4 lines of super glue as that would be pretty much perament, but is 4 dots in the corners on the outside that bad? (Photo below from Rockit Cool)

bad if you plan to remove the IHS later.
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post #1838 of 2724
Quote:
Originally Posted by Jpmboy View Post

bad if you plan to remove the IHS later.

Super glue is actually pretty weak against lateral forces. So if you put the dot on the right side where your delidder provides a shearing force on it, it should pop off pretty easily. I'm not saying you're wrong, but Rockit Cool does specifically mention that they have found this method works well even for taking off the IHS again.
post #1839 of 2724
Quote:
Originally Posted by dmo580 View Post

I wouldn't glue the IHS down with 4 lines of super glue as that would be pretty much perament, but is 4 dots in the corners on the outside that bad? (Photo below from Rockit Cool)


Do the same but with rtv silicone... wait till it dries and it will hold ihs in place as the sglue
post #1840 of 2724
Quote:
Originally Posted by JackCY View Post

Re-lid? Why, just run it naked, what's the point of delidding otherwise if you just change the TIM, sure helps but worth the trouble, nah.

I think the amount of people running Kaby lake and skylake without a IHS could be counted on 1 hand, maybe 2
you can order a delid from some shops
they will glue it back together as well
and still see a temp drop of ~20 degrees


how do you mount any cooler and account for the missing IHS?
they don't make contact

for ivy bridge EK offered a custom mounting option for running without a IHS (that shouldn't fit either any more as the substrate and IHS since then have all a different thickness


I have found only one review of running without a IHS compared to a relid

3 degrees difference
and a whole lot of trouble of mounting and making it work


problem with the original TIM is not just that it is not as good

the space between DIE and IHS is too big

usually you want TIM to fill out the smallest imperfections between 2 surfaces

but since Intel stopped using solder the 2 surfaces don't actually meet and heat is transferred only through the TIM

conventional thinking would suggest running bare would be best temp wise

but liquid metal has so great heat transfer capabilities that it's like when Intel used solder


people were also delidding soldered chips back in the day and saw a reduction in temps in the low single digits (3-5 degrees)

just putting liquid metal as a replacement TIM under the IHS is quite good enough
especially considering that thanks to delidding tools these days less handy people can do it too (means higher chance for chipped DIE's like in the days before IHS on CPUs)


edit:
added a link to the review, bare DIE vs delid-relid

https://m.hardocp.com/article/2017/02/07/7600k_naked_die_cooling_temperature_followup/
Edited by peter2k - 4/12/17 at 12:43pm
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