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[Official] RYZEN 7 1800X | 1700X |1700 Owners Club & 4GHz+ Club - Page 659

post #6581 of 11536
Quote:
Originally Posted by Rainmaker91 View Post

Anyone else notice that Ryzen seems a bit fond of lots and lots of TIM? I'm guessing it has something to do with the cores being on the edge of the IHS. I noticed quite a bit of difference in using the pea method (which is fine on tiny LGA1150/56/55 chips) and the large cross method of applying. The pea method always gives me a slight bit to little to cover the entire IHS, but covers the cores quite well, but the cross covers the entire thing in a ton of paste (though not so thick of a layer).

May just be me thinking I saw something, but it's interesting to see from someone coming from an Ivy Bridge where a tiny amount seemed to be best.

The cores and IMC are still in the middle of the wafer and ihs they are not to the side, Intels cores are on the sides of the die but not sure how Ryzen is. I used a pea method and x method and its perfectly fine. I did notice i used a whole lot less TIM compared to Intel because of the beautiful mounting pressure am4 has.
    
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post #6582 of 11536
Quote:
Originally Posted by drdrache View Post

re-quoted you -
so I got this to work - with a 45 min stability test (AIDA64) - i KNOW this isn't enough - but for now it will be.
all other voltages lasted 2-3 min.

here is HWMonitor (as you can see, it bounces from 1.376 to 1.392):


as my phone is being.... very android like; this is my Offset # as shown in A-Tuning :



the only question I have is - is my temps on par - I'd want to think so, because I can't get a much bigger Air cooler (Noctua NH-D15S single NF-A15) with Kryonaut.

Yeah every chip is different, mine passed 2 hours aida stability test, intel burn test on high, encoding, gaming and other tasks, yours seem to need a bit more voltage, but looks good. Package temp is a bit high, I'd recommend you to get a better cooler when playing at high vcore values.
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post #6583 of 11536
Quote:
Originally Posted by bluej511 View Post

The cores and IMC are still in the middle of the wafer and ihs they are not to the side, Intels cores are on the sides of the die but not sure how Ryzen is. I used a pea method and x method and its perfectly fine. I did notice i used a whole lot less TIM compared to Intel because of the beautiful mounting pressure am4 has.

Might be me just seeing things then, but I did get significant temp differences on air cooling between my mounts though that might be due to different pressure.

Also, what was the conclusion on CPU temps on the C6H again? which one shows the actual temp, or are they all with the offset 20*c for X editions?
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post #6584 of 11536
Quote:
Originally Posted by chew* View Post

Better binned is a strong word.


Binned differently yes.

If we are talking max oc potential equal cooling any forms of cooling. 1800x is curb stomping 1700.
Where are you seeing this? Most of the reviews I have seen have them reaching about the same speed and actually the 1700 reaches slightly higher more often than not. Hard to compare people using LN setups as about 300 people putting an 1800X on LN for every 1 person trying it w a 1700 so for now those aren't very accurate results.

I know AMD gave some numbers about how high each chip will likely go and 1800 has the edge . However AMD kinda has to support that theory to justify price.
Edited by AcesAndDueces - 3/27/17 at 5:50pm
post #6585 of 11536
Quote:
Originally Posted by bloot View Post

Yeah every chip is different, mine passed 2 hours aida stability test, intel burn test on high, encoding, gaming and other tasks, yours seem to need a bit more voltage, but looks good. Package temp is a bit high, I'd recommend you to get a better cooler when playing at high vcore values.

yea, I'm going to figure out what I'm going to do about the cooling - I haven't pushed a machine like this since my 5Ghz Devil's Canyon.
thank you for the support;
I don't know why it took someone else with the same setup for me to even push it to a known "ok" voltage. but - blah.

thanks again!
post #6586 of 11536
Quote:
Originally Posted by Rainmaker91 View Post

Anyone else notice that Ryzen seems a bit fond of lots and lots of TIM? I'm guessing it has something to do with the cores being on the edge of the IHS. I noticed quite a bit of difference in using the pea method (which is fine on tiny LGA1150/56/55 chips) and the large cross method of applying. The pea method always gives me a slight bit to little to cover the entire IHS, but covers the cores quite well, but the cross covers the entire thing in a ton of paste (though not so thick of a layer).

May just be me thinking I saw something, but it's interesting to see from someone coming from an Ivy Bridge where a tiny amount seemed to be best.

This reminds me I need to buy some razor blades...
post #6587 of 11536
Quote:
Originally Posted by savagebunny View Post

Honestly, I don't have a damn clue. I just run it and let it roll. I'm not sure why I get higher numbers.

Which board do you have again? Win10?

Tried and my results suck. biggrin.gif
post #6588 of 11536
Quote:
Originally Posted by mus1mus View Post

Which board do you have again? Win10?

Tried and my results suck. biggrin.gif

Biostar X370 GT7, W10 Enterprise LTSB
post #6589 of 11536
Quote:
Originally Posted by mus1mus View Post

Which board do you have again? Win10?

Tried and my results suck. biggrin.gif

My results rocked too!

I got [TRIAL VERSION]

biggrin.gif
post #6590 of 11536
Not mine. lol

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