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post #7441 of 10504
Quote:
Originally Posted by KraxKill View Post

That "normalized TDP" limit is one major cockblock I tell ya.

Indeed lol

How are you guys doing so far with memory overclocks?

My initial testing is this:

+565 = 14 errors within 30 seconds

+560 = 10 minute run 0 errors (completely stable) biggrin.gif

(In other words, with my memory overclocked to within a ball hair of its life at 560 I'm completely stable.. but even 1mhz more and things go wild lol).

/\ thats at a temp of approx. 60c (fan 100% and a power draw of 277w avg. + default clocks + volts)

+675 = crash
Edited by nrpeyton - 4/27/17 at 8:46pm
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post #7442 of 10504
In the picture's below I'm wondering why ekwb tells you to put the thrmal pads pretty much in the same place on any waterblock that you buy from them, but it differs from nvidia's placement of pads.
Also on the backplate it only shows 4 places to put thermal pads 3 on memory modules and one long strip under the vrm section which is odd, because there are 11 memory modules.
Is this because when water cooling, the board does not get as hot so there is not as much need to cool all of which nvidia does?
Is there any recommended pad placement I should consider when installing ekwb waterblock that they have not specified?





Edited by havoc315 - 4/27/17 at 8:51pm
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post #7443 of 10504
Quote:
Originally Posted by KraxKill View Post

That "normalized TDP" limit is one major cockblock I tell ya.

What bios are you using when you see normalized TDP limit?
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post #7444 of 10504
Quote:
Originally Posted by havoc315 View Post

In the picture's below I'm wondering why ekwb tells you to put the thrmal pads pretty much in the same place on any waterblock that you buy from them, but it differs from nvidia's placement of pads.
Also on the backplate it only shows 4 places to put thermal pads 3 on memory modules and one long strip under the vrm section which is odd, because there are 11 memory modules.
Is this because when water cooling, the board does not get as hot so there is not as much need to cool all of which nvidia does?
Is there any recommended pad placement I should consider when installing ekwb waterblock that they have not specified?




In my experience; it's better to do trial-and-error and see what gets you best temps per sizes.

For example:
In EK manual for my last card (1080 classy) pad sizes were 0.5 mem and 1.0 VRM respectfully.

However I found 1.0mm memory + 1.5mm VRM got me MUCH better temps. Having really good compression on pads helps trumendously. Any good pad will compress to 50% it's original height anyway.
Anything over 3 W/MK is a winner. Compression is also more important than w/mk rating.

I've also seen some old AMD partners use 6mm thick slabs of padding on cards before (in the olden days 9 years ago) -- so when you think about that -- in contrast... it's easy to work out ;-)

I installed probes attached to the back of the PCB (directly behind components) to take temp measurements.
Core temps weren't really affected, but memory overclocking benefited massively. These GDDR5X chips respond very nicely to temps. And the 3 chips nearest the VRM side (furthest away from I/O side of card) get really really hot. Especially on cards with smaller PCB such as FE the issue is even more apparent.

Just be careful.... apply pads.. screw everything back together..
then unscrew it all and see what pads stick. (put something slithery ontop) to see where contact is being missed or where contact is good. <--- i used thermal grease... if there was residue left on the bit the pad was meant to make contact with then ALL GOOD.. If not then you have to look at it all again...

It can be painstaking... going too high on one pad can affect the contact of adjacent parts (even on opposite ends of card)

Once you crack it, you'll feel great. And you'll get an extra 100mhz out your memory that you never thought possible.
Edited by nrpeyton - 4/27/17 at 9:02pm
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post #7445 of 10504
Quote:
Originally Posted by havoc315 View Post

Also on the backplate it only shows 4 places to put thermal pads 3 on memory modules and one long strip under the vrm section which is odd, because there are 11 memory modules.

I don't think they are for memory modules, but rather just standoff protection so backplate doesn't touch components behind GPU. would have been better to just place a pad behind the GPU, which I did as well smile.gif

As for other locations, just try to match what the original heatsink had as close as possible.
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post #7446 of 10504
Quote:
Originally Posted by nrpeyton View Post

In my experience; it's better to do trial-and-error and see what gets you best temps per sizes.

For example:
In EK manual for my last card (1080 classy) pad sizes were 0.5 mem and 1.0 VRM respectfully.

However I found 1.0mm memory + 1.5mm VRM got me MUCH better temps. Having really good compression on pads helps trumendously. Any good pad will compress to 50% it's original height anyway.
Anything over 3 W/MK is a winner. Compression is also more important than w/mk rating.

I've also seen some old AMD partners use 6mm thick slabs of padding on cards before (in the olden days 9 years ago) -- so when you think about that -- in contrast... it's easy to work out ;-)

I installed probes attached to the back of the PCB (directly behind components) to take temp measurements.
Core temps weren't really affected, but memory overclocking benefited massively. These GDDR5X chips respond very nicely to temps. And the 3 chips nearest the VRM side (furthest away from I/O side of card) get really really hot. Especially on cards with smaller PCB such as FE the issue is even more apparent.

Just be careful.... apply pads.. screw everything back together..
then unscrew it all and see what pads stick. (put something slithery ontop) to see where contact is being missed or where contact is good. <--- i used thermal grease... if there was residue left on the bit the pad was meant to make contact with then ALL GOOD.. If not then you have to look at it all again...

It can be painstaking... going too high on one pad can affect the contact of adjacent parts (even on opposite ends of card)
Thank you for the fast reply, because I'm literally sitting in front of my two 1080ti trying to figure out what to do
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post #7447 of 10504
Also can you stack on top of thermal pads as long as the compression is strong enough with a higher-end thermal pad
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post #7448 of 10504
Quote:
Originally Posted by havoc315 View Post

Also can you stack on top of thermal pads as long as the compression is strong enough with a higher-end thermal pad

Yes, as a temporary measure (and to get it all figured out yes absolutely).

But when you have time I'd change it over.

You can get cheap pads at 3 w/mk ish on Ebay for under a 5'er (10cm x 10cm squares) which cut nicely into shape.

The key is sticking something slithery on top the pads (thermal grease?).. screwing together then unscrewing to see where the residue is left. (the pads that have really good compression might even STICK to the block when you lift it back up if the contact is absolutely excellent.

But you won't know for sure how good it is; until you fire it up and do some benches and compare temps.
(Also don't worry too much; if you stick to the manual you can't go wrong -- it might just not be as absolutely perfect as it could be).


There's also no harm in adding extra pads so more of the PCB makes contact with some part of the block. (Just be careful you don't compromise contact on other components in the process).

I've got temp probes attached to a cheap 25 bux fan controller like this:

Just some examples for a bit inspiration (don't worry about going as indepth as me):





This is what I done with my 1080 Classified (I added pads that nvidia/evga & EK didn't use for even more surface area heat dissipation)

right click & 'open new tab' for full size




You don't need to get into it as much as me, or anywhere as near as much detail.

Sorry don't mean to overwhealm you, I'm just crazy as they come lol. (and obsessed with temps and pushing to the absolute limit)...

But notice in my '2nd last picture' how hot the 3 memory chips are compared to the others? (Purely due to their vicinity to the VRM -- a lot of heat spills over from it. After this mod (and a few other little tricks) on my last card; I could hit a ridiculous +925 on memory wink.gif:).

But just to give you a bit inspiration/food for thought :-)
Edited by nrpeyton - 4/27/17 at 9:53pm
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post #7449 of 10504
Undervolting vs stock vs overclocking power draw at 4k max settings:

stockewadc.jpg
undervoltijzng.jpg
overclockncao5.jpg
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post #7450 of 10504
Quote:
Originally Posted by Clukos View Post

Undervolting vs stock vs overclocking power draw at 4k max settings:
Warning: Spoiler! (Click to show)
stockewadc.jpg
undervoltijzng.jpg
overclockncao5.jpg

Interesting, I see the BIOS on the Gaming X also features an extra 30 watts over the FE.

Watts really seem a commodity on the TI.

I really think Nvidia have been far too economical in trying to hit these power targets to meet their TDP targets for shareholders.

They could have at least countered that by giving overclockers the ability in the BIOS to increase the slider further (from say 20% to 40%).

How far that slider will go is 100% down to the BIOS. Nothing else.

Stock cards and OEM systems wouldn't of been affected. Everyone wins.
Edited by nrpeyton - 4/27/17 at 10:02pm
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