Originally Posted by bluej511
True so the highest value we see is the core temp like we do on Intel, that was always the temp i went with. Sure one core might run cooler but considering this is SOLDERED all the cores will run pretty damn close to each other. I know once i delided and ran bare die my cores were all within 5°C of each other.
5°C as number is low. When we view it as % vs another core it could be ~10% difference, which may seem more significant. Mine was not delided, nor on WC or AIO, just decent air.
Loaded ~8°C within current column, ~7°C within max columnWarning: Spoiler! (Click to show)
Idle variation lower.Warning: Spoiler! (Click to show)
Like I posted before my 1st R7 had less of a dimple in centre, my 2nd more. At the time I was using an Archon SB-E X2, this has a convex base and was less flatter than my recently acquired Archon IB-E X2. I forgot to take pics of each CPU/HSF base against metal ruler edge
. But definitely the flatter IB base makes better contact with my 2nd R7 compared with SB. As now TIM has been settling down I see improved temps compared with using SB. I plan to lap HSF base and CPU at some point.
There is post in my thread in sig, even if IHS soldered on a bad mount I had issues with stability on 2nd CPU and there was quite a bit of contact in centre between IHS/HSF.Edited by gupsterg - 4/14/17 at 12:15pm