Originally Posted by Liranan
Intel differentiate consumer and server parts is through ECC and the ability to have 2P configurations. AMD do not disable ECC in the IMC of their consumer chips so unless you absolutely must have higher core count than 8C/16T and need two CPU's you are just as well off with a consumer grade chip.
APU's are different as they are 'FirePro's' and I haven't heard of APU's being flashed from consumer chips to professional grade hardware after firmware flash.
Well yes, but I mean it's the same piece of silicon. Features like vPro and ECC are enabled, but those do exist within the i5s' and i7s' circuits. I was honestly surprised the first time I learned AM3+ CPUs supported ECC. I figured they, like Intel, would lock it to Opterons.
Well, remember, outside of Nvidia's GP100, there really aren't any dedicated server/workstation GPUs. They're mostly just clones of existing gaming GPUs. (Alternatively, the gaming GPUs are clones of the ones for servers/workstations.) APUs are probably just reporting a different GPU ID, running a FirePro rather than a Radeon R7, but the actual processor is unchanged.
Originally Posted by budgetgamer120
What do you mean?
You know how AMD made Bulldozer and, while it was slower than its predecessor, was supposed to make up for that with extremely high clockspeeds? Well, Intel beat AMD to that concept by about a decade when they launched Netburst.
Intel had cash to throw at illegal rebates to keep AMD and their objectively superior CPUs out of OEM systems however, while AMD and Bulldozer just suffered. But we've got Zen now and they aren't bankrupt, so that's somethin'.
Originally Posted by LuckyX2
It will be a server chip if what I saw is correct. 16 Zen cores, 512GB/s HBM2 and a 4+ TFLOP "Greenland"/Vega GPU.
4+ TFLOP implies something around RX 480 tier.
Hmm, I wonder how that will be configured? If they aren't using a monolithic die for Naples I can't imagine they'll cram two Zen CPUs and a Polaris-tier GPU into a single die. That's about 600mm2
worth of processor. Maybe the APUs this gen will have one core complex (4C/8T, like an i7) plus a reasonably powerful GPU (about RX 460 tier) plus
support for a stack of HBM. For their big server chip, four of those dies hooked to one HBM stack each would get you those specs.
Of course, I'm just speculating, but it does make some degree of sense based on what we've seen.
Also Dr. Su said we're going to see HBM APUs at some point in the future and I want them now dangit!