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[DigiTimes] Coffee Lake (LGA 1151 6C/12T) launching in August - Several 'K' Models Planned - Page 2

post #11 of 190
Quote:
Originally Posted by guttheslayer View Post

We have to thanks AMD for that. Not just about buying cheaper Intel cpu.

well frankly we have to thank that an engineer became CEO of AMD and officially recognised that AMD needs to become competitive in performance
Quote:
Originally Posted by guttheslayer View Post

Anyway which post mentioned it will be confirm 6 cores?

as far as I know there is still only that leak from benchlife

there's no confirmation of 6 cores

it only says they come sooner
Edited by peter2k - 4/19/17 at 5:18am
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post #12 of 190
Quote:
Originally Posted by wholeeo View Post

Thank you AMD. Maybe next they'll start using solder again instead of pigeon poop between the die and ihs.

This is the successor HEDT, all of Intel's HEDT parts are soldered. Mainstream (Coffee Lake) gets the full brunt of Intel having to do their part for the environment.
post #13 of 190
Quote:
Originally Posted by peter2k View Post

well frankly we have to thank that an engineer became CEO of AMD and officially recognised that AMD needs to become competitive in performance
as far as I know there is still only that leak from benchlife

there's no confirmation


Truth to be told, we have to thanks Keller.
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post #14 of 190
Quote:
Originally Posted by wholeeo View Post

Thank you AMD. Maybe next they'll start using solder again instead of pigeon poop between the die and ihs.

In case you were not aware, the stock Intel TIM is not that bad. The main issue is mediocre contact between the IHS and the PCB. De-lid, use glue at the corners instead of thick silicone and watch the temps go down tremendously.
post #15 of 190
Quote:
Originally Posted by Silent Scone View Post

This is the successor HEDT, all of Intel's HEDT parts are soldered. Mainstream (Coffee Lake) gets the full brunt of Intel having to do their part for the environment.

I was indeed talking about the mainstream part.
post #16 of 190
Quote:
Originally Posted by geggeg View Post

In case you were not aware, the stock Intel TIM is not that bad. The main issue is mediocre contact between the IHS and the PCB. De-lid, use glue at the corners instead of thick silicone and watch the temps go down tremendously.


They probably will just soldered and stem this PR nightmare once and for all.


Again thanks to AMD they no longer have the power to ignore that. biggrin.gif
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post #17 of 190
Quote:
Originally Posted by geggeg View Post

In case you were not aware, the stock Intel TIM is not that bad. The main issue is mediocre contact between the IHS and the PCB. De-lid, use glue at the corners instead of thick silicone and watch the temps go down tremendously.

not by as much as solder would reduce temps

1485902792FcMK26VeK8_1_9.png
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post #18 of 190
Quote:
Originally Posted by geggeg View Post

In case you were not aware, the stock Intel TIM is not that bad. The main issue is mediocre contact between the IHS and the PCB. De-lid, use glue at the corners instead of thick silicone and watch the temps go down tremendously.

I'm very aware, take a look at my signature. I've been delidding these things since the 3770K.
post #19 of 190
Quote:
Originally Posted by wholeeo View Post

I'm very aware, take a look at my signature. I've been delidding these things since the 3770K.

It's the pigeon poop remark that made it seem you weren't aware about the gap.
post #20 of 190

Hang on...

 

Is Intel doing anything but sit on their swing chairs twiddling their fingers?

 

Jesus Christ this day should be remembered for the rest of the times!

 

Quote:
Originally Posted by guttheslayer View Post

They probably will just soldered and stem this PR nightmare once and for all.
Again thanks to AMD they no longer have the power to ignore that. biggrin.gif

 

 

They probably won't. Just like nVidia, people will buy their stuff no matter how crap it is or how expensive it is.

 

Note that I'm not saying it's crap or expensive (well, it is expensive, that I am saying).

   
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