Originally Posted by DigiTimes
Intel will unveil its Basin Falls platform, i.e. Skylake-X, Kaby Lake-X processors and X299 chipset, at Computex 2017 in Taipei during May 30-June 3 two months earlier than originally scheduled, and will bring forward the launch of Coffee Lake microarchitecture based on a 14nm process node from January 2018 originally to August 2017, to cope with increasing competition from AMD's Ryzen 7 and Ryzen 5 processors, according to Taiwan-based PC vendors.
...As for the 14nm-based Coffee Lake-based processors, Intel will initially release several K-series Core i7/i5/i3 processors and its Z370 chipsets in August, and will release more CPUs as well as H370, B360 and H310 chipsets at the end of 2017 or early 2018.
Looks like AMD finally forced a hand, showing us how much Intel was milking us and sandbagging. Yeah yeah I know they had no reason to cause no competition blah blah but still. No regrets with Ryzen, Intel and nvidia can suck it now, I know it won't make a dent in their market share but they won't be getting my money again, once was enough.
I really hope those 6-core Coffee Lakes work with existing Z170 boards. It's got the same socket even, don't be pulling any artificial obsolescence tricks on us Intel.
This is the successor HEDT, all of Intel's HEDT parts are soldered. Mainstream (Coffee Lake) gets the full brunt of Intel having to do their part for the environment.
well frankly we have to thank that an engineer became CEO of AMD and officially recognised that AMD needs to become competitive in performance
as far as I know there is still only that leak from benchlife
In case you were not aware, the stock Intel TIM is not that bad. The main issue is mediocre contact between the IHS and the PCB. De-lid, use glue at the corners instead of thick silicone and watch the temps go down tremendously.
This is the successor HEDT, all of Intel's HEDT parts are soldered. Mainstream (Coffee Lake) gets the full brunt of Intel having to do their part for the environment.
In case you were not aware, the stock Intel TIM is not that bad. The main issue is mediocre contact between the IHS and the PCB. De-lid, use glue at the corners instead of thick silicone and watch the temps go down tremendously.
In case you were not aware, the stock Intel TIM is not that bad. The main issue is mediocre contact between the IHS and the PCB. De-lid, use glue at the corners instead of thick silicone and watch the temps go down tremendously.
In case you were not aware, the stock Intel TIM is not that bad. The main issue is mediocre contact between the IHS and the PCB. De-lid, use glue at the corners instead of thick silicone and watch the temps go down tremendously.
It was rumored for almost 2 years that it will arrive in Q2 2017. So it is not a very big surprise. "soon" could be just august instead of september. And could be just with enough stock instead of flooding the market like previous times.
They are not doing it for charity.
And blame it on AMD for not giving intel a good enough competition for almost the last decade.
When you don't have competition, you can do whatever you want. And you can see that in every single place in every market.
They are not doing it for charity.
And blame it on AMD for not giving intel a good enough competition for almost the last decade.
When you don't have competition, you can do whatever you want. And you can see that in every single place in every market.
I've lost the count of people that buy nVidia and Intel because there is a sticker on them that says Intel or nVidia.
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