I´ve heard cooler VRM results in lower consuption[/URL], so I wanted to try it.
here is my blender concept
and here the firts prototype made of 1mm thin copper plate
I had some probleblems getting it flat, but seemed ok and with thermal pad I gived it a try.
after analyzing the results, I am not sure if it makes good contact at all VRMs.
some are better somer are worst, but at all the minimum temps are better.
and somehow it is not as how as expected by touching it.
maybe using thermal glue?
- false
- you can improve OC stability
- 70°C are NOTHING for VRMs, call me when they are above 95°C
- too thin foil, after some cm it's already at ambient temperature so that long lenght is useless
- put thermal pad between foil and VRMs, put thermal paste between foil and heatsink
if the foil isn't perfectly flat you should use thermal pad also between foil and heatsink
but the thermal resistence added by the 2°pad will make it altogheter less performing
- optimal : big solid block of copper
u look at wrong temps, the 70s are on VCA VTT and VDIMM
the CPU vrms are over 80 and this will limit my further oc, one day when I got a new cooler for CPU.
Quote:
- too thin foil, after some cm it's already at ambient temperature so that long lenght is useless
good point!
did you modify the clamping mechanism ?
1mm of additional thikness + original mechanism = too much pressure -->bend motherboard, poor contact, crack of components,...
check it
p.s. sorry I got the wrong vrm, I usually don't have so much values
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