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[TechPowerUp] Aqua Computer and Rockit Delidding Tools tested on Core i7-7700K - Page 6

post #51 of 59
Quote:
Originally Posted by Seijitsu View Post

More tests need to be done if we want accurate results within a degree C. How about 10 different processors delidded, cleaned, and pasted 10 times each, cooled with very precise temperature controlled water, then average the results?

Doing it once and comparing the results is why we don't have a consensus on these matters. Everyone has a different result or say. Does the gap matter or not? These results seem to show TIM is the only issue. The old Anandtech thread pointed to the gap being the issue in Ivy Bridge.

I can say this for kaby lake and sky lake. I have seen some that the TIM application just sucked. Meaning it looked like there wasn't enough TIM added as there were bald spots on the Die and IHS. Some have had to much. And some the adhesive was wayyyyy to thick to where you could tell that it was not pressing correctly.
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post #52 of 59

Looks to me from the data of glue used that the space between the die and IHS is what makes the difference. And that's maybe why you get a large temp difference from cpu to cpu from deliding, is because not every CPU has the same thickness of glue which determines the width between the die and IHS. 

 

I just don't think its the paste quality.  

 

 

And how can the guy above say these results show tim is the only issue when the thinner glue(super glue) which netted a smaller gap between the die and IHS achieved better temps?


Edited by Dragonsyph - 4/27/17 at 6:46pm
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post #53 of 59
Quote:
Originally Posted by Dragonsyph View Post

Looks to me from the data of glue used that the space between the die and IHS is what makes the difference. And that's maybe why you get a large temp difference from cpu to cpu from deliding, is because not every CPU has the same thickness of glue which determines the width between the die and IHS. 

I just don't think its the paste quality.  


And how can the guy above say these results show tim is the only issue when the thinner glue(super glue) which netted a smaller gap between the die and IHS achieved better temps?

Look at the results again:

Intel TIM= 55.2C
Liquid metal= 34.5C

Difference in height= 0.01mm (Negligible)

Obviously TIM is the primary issue here, height plays a very small role in their results.
post #54 of 59
Quote:
Originally Posted by Dragonsyph View Post

Looks to me from the data of glue used that the space between the die and IHS is what makes the difference. And that's maybe why you get a large temp difference from cpu to cpu from deliding, is because not every CPU has the same thickness of glue which determines the width between the die and IHS. 

I just don't think its the paste quality.  


And how can the guy above say these results show tim is the only issue when the thinner glue(super glue) which netted a smaller gap between the die and IHS achieved better temps?
If you were referring to me that's not what I was pointing out. I was just stating what I have seen over the course of delidding. I didn't say what was causing the issues lol. I even stated that that the sealant adhesive was in the list of it..

But along with that after looking back at a pic of the TIM, some already being chalked kinda goes along with shoddy TIM.. but hey I've only done 15 of them so far.lol

Edited by kfxsti - 4/27/17 at 7:49pm
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post #55 of 59
Quote:
Originally Posted by KyleAPowers View Post

I agree, why the hell would a company invest so much capital into the development in their technology, only to undercut its performance by using inferior components such as thermal paste and a poor lidding?!

So that you do less overclocking and buy the next chip they release
post #56 of 59
Quote:
Originally Posted by budgetgamer120 View Post


So that you do less overclocking and buy the next chip they release

At that point just produce a smaller chip or push off a lower binned chip. Deliberately sabotaging overclocking this way without taking other actions is dumb.
 

   
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post #57 of 59
I used super glue the first time. only saw 6c diff on my 4790k. Re did it and did no glue and saw another 12c come off. I say leave it without any glue. To bad they didnt test that too.
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post #58 of 59
nevermind, found out from another forum that it only support skylake and kaby lake
Edited by clarifiante - 4/28/17 at 2:05am
post #59 of 59
Quote:
Originally Posted by Darkwizzie View Post

I wouldn't say it's clear cut that Conductnaut is better than CLU, there just aren't enough good tests to run this. I'd at least wait until der8auer or VSG tests it before I just say flat out it's better.

FYI, Der8aurer is part of Thermal Grizzly. That said he has still tested their products on his website so you can request him to do the same for Conductonaut as well. I will not do liquid metal for thermal conductivity measurements.
Quote:
Originally Posted by Taint3dBulge View Post

I used super glue the first time. only saw 6c diff on my 4790k. Re did it and did no glue and saw another 12c come off. I say leave it without any glue. To bad they didnt test that too.

It wasn't even my CPU, so time was a factor. But in case I get to do this again that will definitely be on the list.
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