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[pcgamer] Intel tells Core i7-7700K owners to stop overclocking to avoid high temps - Page 9

post #81 of 264
Quote:
Originally Posted by Megaman_90 View Post

Thats awful. I would not go Intel right now simply because you need to void your warranty to get good temps. tongue.gif

Was a good move on AMDs part to solder the cpu to the spreader.

Hopfuly they use a better thermal paste in their next get CPUs. Its not like they can't afford it.
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post #82 of 264
Quote:
Originally Posted by Slink3Slyde View Post

Mostly agree with you, but you also have to look at die sizes on Intel mainstream Vs Ryzen. That's also the reason there's TIM and not solder anymore.

True but pretty sure even the ryzen 5 is soldered, ryzen 3 may as well be. All they are are ryzen r7s with non functioning cores per ccx. But then again soldering is always better anyways its why we use liquid metals.

I didn't notice Intel TIM being/looking any different then other TIMs, however after doing 2 months of testing with delided 6700/7700ks i did notice that ALL of them had thermal paste that was too thick and thats a problem. If you compare it to a cooler sitting on an IHS that squishes the TIM to almost non existence its no wonder why deliding helps. If there was no glue gap and high pressure of the ihs onto the die youd have zero temp problems even using Intels dow corning TIM.
    
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post #83 of 264
Quote:
Originally Posted by bluej511 View Post

True but pretty sure even the ryzen 5 is soldered, ryzen 3 may as well be. All they are are ryzen r7s with non functioning cores per ccx. But then again soldering is always better anyways its why we use liquid metals.

I didn't notice Intel TIM being/looking any different then other TIMs, however after doing 2 months of testing with delided 6700/7700ks i did notice that ALL of them had thermal paste that was too thick and thats a problem. If you compare it to a cooler sitting on an IHS that squishes the TIM to almost non existence its no wonder why deliding helps. If there was no glue gap and high pressure of the ihs onto the die youd have zero temp problems even using Intels dow corning TIM.

Well yes smile.gif all the Ryzens are soldered because they're all the same size. Not even sure actually on the size of the 7700K die, can only find info on Haswell and earlier for some reason, but I'm pretty sure it's smaller in total although not per core from what I can find on my phone on the bus tongue.gif
post #84 of 264
Quote:
Originally Posted by mypcisugly View Post

wth.gif

It's thanks to this advertising that means if my CPU failed due to overclocking I would be able to get it replaced whether the manufacturer's warranty is voided or not. Delidding is another issue. I wouldn't get away with that as it is not intended usage.
Edited by randomizer - 5/5/17 at 7:02am
    
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post #85 of 264
Quote:
Originally Posted by DarkBlade6 View Post

There's no issue with the CPU itself ... it's just the terrible TIM that they use that ruin such a good processor.

So there is an issue with the CPU tim then? rolleyes.gif
post #86 of 264
The factory GAP is the main issue. The one between the die and the IHS.
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post #87 of 264
Quote:
Originally Posted by bluej511 View Post

People still blaming the TIM this is just too funny lol. I can get the same results using kryonaut if i apply too much and have low mounting pressure. Too much TIM is a bad thing, ill even go as far as saying any TIM is a bad thing. Copper to copper dissipates heat much better then any TIM ever could including 78w/mK condoctunaut.

Its a combination of things in this EXACT order. IHS to wafer gap>thick IHS>TIM. The TIM is the least of the problems, its a problem but not as much as everyone has theorized about. A gap between two heater surfaces is bad, the more TIM in between the least likely it is to work. Proof? My higher TDP 1700x runs at the EXACT same package temps as my 4690k both at 1.2v.

You dont want a gap and that's why deliding works, youre getting rid of 100% of the glue and putting more pressure on the die, but the IHS is also thicker. Guaranteed if someone lapped the IHS top and bottom (bottom that touches the wafer and not the die) your temps would drop massively. The thicker the IHS the worse it is, if it wasn't true then running bare die would have zero difference but it does indeed.

P.S. My 1700x at 1.2v and 3.8ghz peaks at 50°C (on water) and hits around 130w.


You can still glue back the IHS after delidding and the temp is still great (there was a review for doing that using a 3rd party delidding kit), just superglue the 4 corners of the IHS to the chip and bam, done.


Cant believe Intel cant even do this simple job.
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post #88 of 264
I thought that was always the case since forever. Overclocking voids warranty. Unless that changed some time in the last 20 years. I assumed they offer k chips cause people will buy them, but overclocking is not officially supported and they can deny warranty because of it at their discretion. I actually never assumed otherwise, but i also haven't read warranty terms on a cpu since proabably 17 years ago. Pretty sure that used to be the case for cpus And video cards and would actually be pretty surprised if it isn't still today.
post #89 of 264
I think the TIM problem rests with the application, not the substance itself. Also the IHS to die gap created by the adhesive.

My question is why doesn't Intel use the GPU method and use a bare die with a metal shim around the periphery?
    
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post #90 of 264
Quote:
Originally Posted by guttheslayer View Post

I'm just curious though,


Once delid and apply Liquid Metal, do you still need to reapply every 6-12 months? Or applied once and can be used till it died?


In other words does the thermal conductivity of LM actually last over time?

I had to reapply it to my 4770k about once a year. Usually after a bout of impulsive overclocking where I would go over 1.4v. I lost functionality of sli once, checked everything else, pulled the cpu and found a lot of the coolabs pro on the die looked dried. It was probably oxidized. I reapplied it and everything was good for another year when I lost use of a ram channel. Tried a bunch of stuff before checking that and clp turned to dust over a big part of my die again. This time it left a film that was tough to get off. I put it on real thin on both surfaces though since I'm worried about drips and that might have something to do with it.
Went back to regular tim after that and while my temps weren't as good as with the clp, they were still better than original. I use as5 because it seems to last forever. Tried mx-4 and all of the good stuff kept getting pushed out leaving only oil.
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