Originally Posted by Duality92
The factory GAP
is the main issue. The one between the die and the IHS.
Yea correct, can't believe people still argue this. I guess the physics behind thermodynamics eludes them.
Originally Posted by guttheslayer
You can still glue back the IHS after delidding and the temp is still great (there was a review for doing that using a 3rd party delidding kit), just superglue the 4 corners of the IHS to the chip and bam, done.
Cant believe Intel cant even do this simple job.
Correct, but superglue isn't remotely as thick as rtv. I'm sure you can glue the IHS back on provided you add pressure to the IHS while it cures. People still fail to understand that between two layers of any material conducting heat you want no gap, in a perfect world you don't even want TIM, TIM is a piss poor heat conductor. Don't believe me? Compare copper at 300-400w/mK (yea thats right) to your best TIM that does 12w/mK and liquid metal that does 76 w/mK. Which one do you think conducts heat better? Air is a piss poor .024w/mK.
The more TIM you use the worse of it is, i tested this by using thick dried out hydronaut on my 1700x, temps shot up to 73°C instantly while my Noctua kept it at 68°C after 15mins, i didn't even let hydronaut run that long. You want the TIM to be a microscopic layer, you're filling in the gap between the center of the IHS and the center convex heatsink, the other parts of the IHS don't matter.
Heres the article in question. https://www.techpowerup.com/reviews/Intel/Delidding_the_Intel_Core_i7_7700K/4.html
The graphs are VERY telling BUT don't forget that this wasn't a full on test, he didn't try TIMs by reducing the gap and went straight to liquid metal which you can use as thick as you want and still functions at its rated w/mK.
"These are absolutely massive decreases; 20.7 °C from the TIM swap and fresh batch of silicone glue and 24.4 °C from the TIM swap and super glue. By going with a drop of super glue at each corner instead of a layer of silicone glue in between, I reduced the distance between the CPU die and IHS and, thus, also reduced the heat-transfer distance, which aided heat transfer away from the die. So there are two variables at play here which both affect the internal heat transfer from the CPU die to the IHS, and you want to work on both for the best-possible results. Take these numbers as an indicator rather than absolutes as I am sure I could have achieved better results with the silicone glue run, and there is also no guarantee my liquid metal spread was consistent both times. Similarly, the measured thermal conductivity value for the Intel stock TIM was 3.1 W/mK. Note that this is more of an indication of where things are at, but it is not as bad as many would have you believe. Most stock TIM provided by manufacturers of coolers and waterblocks alike are in the 2-4 W/mK range as is. But Thermal Grizzly Conductonaut has an advertised thermal conductivity of 73 W/mK, and this is a big, big part of that 20+ °C drop in temperature."Edited by bluej511 - 5/5/17 at 8:01am