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No significant Temp drop after Lapping CPU's IHS...

post #1 of 10
Thread Starter 
I've already lost count how many hours I've spent lapping my E6700's IHS but the result was rather dissapointing. I'm basically getting the same load/idle temp as before or maybe 1 degree drop under full load Orthos small fft. Ambient temp is roughly the same at around 21 ~ 23 Celcius.

This is my first time doing lapping and I challenged myself to do the CPU's IHS for the first time. I think I did a fairly good job at the end. I managed to get the IHS to a semi-mirror finish with 2000grid and becouse I'm short in supply of 2500grid I couldn't finish it with a perfect mirror finish. At least it's all copper and nice and flat. I use both bar codes and graph paper to check for flatness and they shown perfectly OK. I also did the ruler and glass table test for flatness and they all seems preety flat to me.

My E6700 Batch# L633A557 is OC'ed to 3730mhz @ 1.48v (1.5125 BIOS) Idle temp is at 40 ~ 42c and full load stress Orthos goes up 66 ~ 66.5degrees (Was getting 67~68 degrees before)

I'm still using Zalman 9700NT cooler before and after the lapping. I'm not sure what to blame then. Is it the Zalman cooler is having a hard time keeping temp down at such a high clock of 3730mhz and high voltage @ 1.5v that even a lapped IHS doesn't seems to help much. Now I'm thinking If I actually did a screwed up job, wouldn't the temp actually increase than before? but it doesn't and it dropped by 0.5 ~ 1 degrees only...

What do you guys think?

TIA
    
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post #2 of 10
How much AS5 did you use? your 9700NT should be lapped out of the box and you lapped your HIS. try and squeeze out 1/4 of a grain of rice.
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post #3 of 10
Perhaps you used too much thermal paste? I redid it and my temps came down with 4-5 degrees. But it's odd that your temp didn't come down with the lapping.

Mine came down by 8 degrees. From 60 to 52. I'm thinking you used too much thermal paste. Try putting a small half rice grain size in the center. Worked for me.
    
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post #4 of 10
Thread Starter 
I stopped using AS5 after I found out that AC MX-1 is actually better from many reviews. I use the official AS5 application instruction to apply the MX-1. I drew a vertical line in the centre of the IHS. I was using the same method with AS5 and MX-1 and the temps were preety normal for an my OC'ed CPU but I'm surprised that with the same method on a lapped CPU, I'm getting the same temp...

Yes the Zalman 9700 came with a mirror finish like Enzo Ultra-x's base.

Maybe the official AS5 application instruction method is still too much for my lapped CPU + heatsink?!

However, I remember reading gray's Q6600 lapping review that he said he still had to use the same amount of TIM to for his lapped CPU to get lower temp becouse his temp didn't improve with less TIM applied.

Another thing is MX-1 is suppose to use a BB size amount of TIM on the centre and the amount is more than what AS5 normally would use.

Thanks
    
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post #5 of 10
Couple of thing's here.I lapped my 6700 ES too.And you rigth the temps reductions.They no great,im almost went down 1c to 2c max.Im using 1.5 for a oc of 3.5.You said you have 3.7 with 1.48 or so?You have any cpu-z shot to showme?Or orthos shot?You stable?My 3.5 with 1.5 is stable in orthos.And temps sometimes reach the 57c to 58c.Oh i lapped the tunic tower too.

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post #6 of 10
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post #7 of 10
Methinks you applied the wrong amount of thermal paste. It may also be that the paste between the core and the IHS was applied badly. Is it too much of a stretch to suggest removing the IHS at this point?
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post #8 of 10
Hi.

Has the ambient temperature risen? This would affect the CPu's temps. As an example. Essentially I am bakc to where I started with Idle and Load Temps, but the ambient temperature of my room is up 10C.

That is a performance gain.... it just may not seem like it.

The CNPS series of coolers requires a cross-flow of air for optimal performance, have you attended to such?

If may be the cooler. Don't take my words the wrong way... I have a CNPS9500 and I LOVE it!.... it just could not compete with the Noctua 120.

Surface area plays an integral part of thermal disipation. The CNPS lacks the surface area that the Noctua has. Perhpas you have reached the thermal transfer limit of the cooler itself.

AS5: In some cases finely lapped surfaces do not require a TIM, and in all cases that I have run into it requires less, much less.

Additionally you have a nice OC on that processor along with a hefty Vcore...I think that the Zalman may be at its limit, but I am just theorizing.
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post #9 of 10
Have you experimented with your case fan set-up?
Those Zalmans need excellent airflow to be efficient.
Looking at your specs it seems you have more intake then exhaust.
You may not be expelling hot air at a high enough rate, have you tried more exhaust then intake yet?
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post #10 of 10
Thread Starter 
Thanks for the replies guys.

1. I've tremedous cool air flow in my entire system. "Wind tunnel" Push-Pull basis effect (2 * 120mm fans working in series) in the top compartment of the Antec 900. 1* 200mm fan exhuast and 1 * 120mm fan exhuast at 1600rpm. The air flow is massive in my case. The ratio of intake / exhuast is preety even and I can confirm the airflow isn't restricting the CNPS 9700NT's performance. I custom build everything precisely in my system so this can't be the downfall.

2. Thermal paste...it also could be that I apply too much thermal paste and by what I mean too much is I use the same amount of MX-1 as I did in the past with un-lapped E6700. The vertical line isn't too streched, it's exactly the same as illustrated from AS5's instruction site but applied with AC MX-1. Since both the heatsink and IHS are lapped and mirror-finished, I think I'll reduced the amount of TIM from a vertical line to a grain of rice side in the centre (50% reduction)

3. I'll redo a quick lap again later today starting with 600 grid and on for 10mins each...Maybe I didn't get a PERFECT 100% flat (I suspect the 4 corners are a bit rolled off which is also a common case with a lapped IHS)

4. I'll try different combinations of method to see if this remedies the poor lapped performance...and if the combined methods doesn't further bring down the temp to a satisfied level for a lapped CPU, it may very well possibly means that it's CNPS 9700NT's max threadshold at this clock speed : voltage input.

Thanks
    
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