Anyone get Maximum PC Magazine? This is on page 9 of the June issue. I searched the website to see if I could provide a link but, as part of the â€œquick startâ€ section, it is not coming up. I thought this was interesting enough to share:
Again, as a sidebar in the magazine, this snip-it of information didnâ€™t come up at the website to provide a link. If anyone can corroborate that Iâ€™m not making all this up, please do so. Thanks!
X Marks the Warmth
Betcha didnâ€™t know this: When you spread thermal paste across a CPU â€“ even a fancy name-brand paste â€“ you lose about 40% of the CPUâ€™s cooling efficiency to the ceramic or metal particles that make up the thermal compound. And according to IBM, the CPUâ€™s thermal budget is further depleted by the peculiarity of the pasteâ€™s flow behavior.
Researchers at the computing behemoth noticed that as a CPU heats up, paste particles bunch together along the diagonals of the chip, forming an X pattern of sorts. Obviously, this runs counter to the â€œspread evenlyâ€ recommendation we give for thermal-paste application.
To address the issue, IBM has designed a trench-like, microscopic irrigation system for CPUs. This lowers paste thickness, reduces the pressure between the CPU and the cooling unit, and ultimately doubles a chipâ€™s cooling efficiency. The only downside? Thereâ€™s no ETA for this technology to hit consumer chips.