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E4300 temps? - Page 2

post #11 of 15
Thread Starter 
Quote:
Originally Posted by TaiDinh View Post
When putting on AS5, many recommend only using a 1/2 of a rice grain size in the middle of the heat sink and let the contact of the CPU and heat sink spread the paste apart. AS5 takes a total of 200 hours to settle in. A settlement of daily cycles of on and off usage.

I have heard many rumors about the heat issues of the E4300. The reason is that the IHS is not made like the E6x00(s). It is more concave than the others, making it a lot harder for the heat sink to transfer the heat.

You should look into lapping only IF many other users on this forum recommends it.
I'm a bit confused about the amount of compound. You mention 1/2 a grain of rice, other's have mentioned (as I previously read) a full grain of rice...

I remember when I was playing around with my old P4, a grain of rice sized amount of AS5 resulted in absolutely horrendous temperatures. Applying a roughly 0.5mm layer of compound across the chip had much better results. That's what I did this time around, too.
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post #12 of 15
Quote:
Originally Posted by kerunt View Post
I'm a bit confused about the amount of compound. You mention 1/2 a grain of rice, other's have mentioned (as I previously read) a full grain of rice...

I remember when I was playing around with my old P4, a grain of rice sized amount of AS5 resulted in absolutely horrendous temperatures. Applying a roughly 0.5mm layer of compound across the chip had much better results. That's what I did this time around, too.
Well, in my experience, I haven't seen a difference if I use the AS5 recommended half-grain of rice size amount, or if I slop it all over the IHS and spread it out evenly. If you have both a flat HSF and a flat IHS, all of the AS5 will be evenly distributed (and extra squished out the side--which is not necessarily preferable) when you crank the HSF down--but if you have concave IHS, things might be different.

Let us know how dropping the vcore goes. 1.4v is quite a bit for a C2D.

If the 120mm fan you have on the side of your case is sorta between the rear exhaust 120mm and the CPU HSF, you might want to think about putting the side 120mm as a front intake instead of a side intake--the more linear throughput you have through the case is better--ensures better airflow and fewer dead zones. But if the side fan is directly on top of the fan for the HSF blowing fresh air directly on it, then it should be good to go. Just my 2-cents.

Yes, you might want to consider lapping the IHS (or, if others recommend, removing the IHS, but I have no experience in that whatsoever, so woudln't recommend it myself).

Hopefully just dropping the vcore helps. I think you should be able to get decent OC's even on 1.2 or 1.1 v. C2D's have been known to OC on stock voltages very easily (or even less than stock).

Hopefully all goes well. Don't fry anything!
    
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post #13 of 15
Thread Starter 
I played around with different settings today.

This is pretty much the best combination I had:

Core multiplier: 8
Bus speed: 313
vCore: 1.225 (the lowest option my motherboard allows)

This is 2.5GHZ, and is what I'm using right now.

I've had Prime 95 running for about a half hour now, and the temperatures jump between 52 and 54 degrees. I think this is OK?

---

The side fan I have is blowing air a bit to the right of the heatsink. I have a custom-made "tube" which fits perfectly over top of my heatsink and leads right to the side fan. It's meant to direct fresh air right onto the CPU heatsink. I'm not using it at the moment because I'm worried that it might restrict airflow, but I might try it out and see how things go...

I'm thinking that maybe picking up a different heatsink will help? Currently I have a Zalman 7700 AlCu. Will a BT make much of a difference?
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post #14 of 15
Quote:
Originally Posted by kerunt View Post
I played around with different settings today.

This is pretty much the best combination I had:

Core multiplier: 8
Bus speed: 313
vCore: 1.225 (the lowest option my motherboard allows)

This is 2.5GHZ, and is what I'm using right now.

I've had Prime 95 running for about a half hour now, and the temperatures jump between 52 and 54 degrees. I think this is OK?

---

The side fan I have is blowing air a bit to the right of the heatsink. I have a custom-made "tube" which fits perfectly over top of my heatsink and leads right to the side fan. It's meant to direct fresh air right onto the CPU heatsink. I'm not using it at the moment because I'm worried that it might restrict airflow, but I might try it out and see how things go...

I'm thinking that maybe picking up a different heatsink will help? Currently I have a Zalman 7700 AlCu. Will a BT make much of a difference?
Well, others have gotten higher on that same voltage--but I don't have a C2D, so I can't say much other than that.

54C is fine for under-load temps running orthos prime or prime95--these programs stress the CPU WAY more than any normal or moderate usage. Typically under 55C is the rule of thumb.

I would recommend using the air-duct to help direct fresh air onto the CPU HSF--it definitely helps if you have a HSF that blows air towards the CPU to cool it. Before I upgraded to my Zalman, I noticed that without the duct, my temps were at least a few degrees hotter--maybe 3-4C. Regardless of how much it changes, it is an improvement--don't worry about airflow in that area--there are no components around the side of the case that need proper airflow. Also, I'd recommend getting a third fan as an intake at the front of the case (if you don't have one already). Overall temps might cool down considerably.

I think your HSF should be adequate--you can always upgrade, but the thing is there's no way to know if your temp issues are because of the HSF, or because the CPU itself is just hotter than other CPU's. It's your call. I didn't look up the one that you mentioned, but if possible, get a HSF that directs air in the same direction as the rear case exhaust fan--it's much more efficient. Doing that should probably help temps too, but not necessarily drastically.
    
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post #15 of 15
Quote:
Originally Posted by kerunt View Post
Hi All,

Today I picked up some new hardware :

- LG L194WTX-BF 19IN Widescreen (two of these)
- Intel Core 2 Duo E4300
- OCZ Gold XTC PC2-6400 2GB 2X1GB DDR2-800

Out of the box, idle CPU temp (as reported by SpeedFan and Asus Probe) is about 41 degrees (this is with Arctic Silver 5 and a Zalman 7700 AlCu). When I overclocked to 3.5 GHZ (didn't touch the vcore), idle temps jumped to about 45 degrees. The system ran and booted fine, but under Prime 95 the CPU temps went into the 60s.

I don't know much about overclocking, but I can assume that's a bit too hot...

I tried smaller overclocks (2.7ghz), and the results were pretty much the same (1-2 degrees difference). The only way I can get it to run under 60 degrees on full load (Prime 95) is at stock 1.8 ghz.

Any tips/suggestions?
I don't claim to be an expert on overclocking, but I have the same HSF as you do, except All Cu (copper). When I first got the zalman, I thought wow this is massive, must be the best. Now I realize there are far better heatsinks such as a tuniq tower or thermalright ultra-120 extreme. And if you lap them, they only get better (by 2C+ or so). I really think you need a new CPU fan. You will notice a huge difference.

Just last month I was thinking of getting that allendale with a thermalright ultra-120 extreme, but now realize I want and should wait for the Q6600 price cuts on the 22nd of July. Now I'm debating whether or not to watercool or go with a thermalright. We'll see... I would highly recommend either the thermalright or tuniq and you should (like 99.9% sure, your temps will drop dramtically). They have a bigger 120MM fan and are much larger.

Hope this helps .

Oh yeah, check this out too, your gonna need to use a lot more AS5 then 1/2 a grain of rice.

http://www.arcticsilver.com/pdf/appi..._quad_wcap.pdf
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