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E4400 (from 2.0 to 3.0), northbridge fan,

post #1 of 16
Thread Starter 
Hello,

My first time building a system, and I wanna OC it as well, probably the reason why I bought the E4400.

Motherboard: GA-P35C-DS3R
CPU: E4400 (stock fan)
MEM: 4GB 800Mhz GSkill 5-5-5-15 (1.8V - 2.0V)
Case: 120mm rear fan

I basically want to OC from 2.0Ghz to 3.0Ghz, and also speed up my RAM to 1066Mhz. Do I need more cooling, maybe like a north bridge fan? And do I need to change voltage settings? Or is that subjective?
post #2 of 16
i would since if u touch the stock its really hot. i have the TT Spirit II. great cooler. I would also swap out the stock HSF if you want to clock higher. =)
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post #3 of 16
Quote:
Originally Posted by luckii View Post
i would since if u touch the stock its really hot. i have the TT Spirit II. great cooler. I would also swap out the stock HSF if you want to clock higher. =)

I second the TT Spirit II. I ran it on an OCed 4300 at 3.2GHz on as ASUS 650i chipset. It doesnt even interfere with the Zalman 9700 CPU cooler!
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post #4 of 16
Quote:
Originally Posted by boohoo View Post
Hello,

My first time building a system, and I wanna OC it as well, probably the reason why I bought the E4400.

Motherboard: GA-P35C-DS3R
CPU: E4400 (stock fan)
MEM: 4GB 800Mhz GSkill 5-5-5-15 (1.8V - 2.0V)
Case: 120mm rear fan

I basically want to OC from 2.0Ghz to 3.0Ghz, and also speed up my RAM to 1066Mhz. Do I need more cooling, maybe like a north bridge fan? And do I need to change voltage settings? Or is that subjective?
I do not think the problem will be the northbridge. You will surelly need more case fans and if its possivle one to the front and one fo the side. The front to create a good airflow from front to back and the side to blow air on the mobo.

Ofcourse you will need a good CPU cooler. Surely not the stock cooler. Do not tire your CPU. It works so hard for you so at least give it a small comfort. Afar from these you can use the thumb metric system or in other words use your figner and check each part if its too hot and decide what to change. A good temp for me is the temo that will allow me to leave my finger on it without getting too much hot to not stand it. I got thin skin (sadly) and i think that helps me. My rams were too hot so i stuck on the ram heatsinks some small heatsinks that usually go on the vga's rams. Well I hope you will be able to give it a good cooling.

For CPU i would choose either Big Typhoon or Ultra 120 extreme. Actually I would take ultra 120 extreme but if you can;t add side fans then you should add a CPU cooler that blows the air on the mobo for some extra cooling. I usually choose coolers that push the air on the back because I have side fans.
    
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post #5 of 16
Thread Starter 
Ok I'm sort of confused.

Here's my motherboard: http://dh.mjsabby.com/mobo.jpg
Here's the case: http://www.newegg.com/Product/Produc...82E16811147042

Now, you guys are suggesting to not install the stock CPU cooler at all, just get the Thermaltake one, or the other one suggested by weltall and replace the intel fan. Right?

Secondly about the case fan, the Rosewill description says that there's place in the front for a 120mm fan, that I've ordered. I don't know if there's place for a side fan, it just seems like a vent.

Also, no need for a nothbridge fan.

How do I cool the RAM, that's inserted vertically? there's a fan for those things as well?

OCing is crazy exciting! I'm thinking I should first get the system completely up and running on the stock speeds and components, since these extra fans will take a few days to ship. Then OC it!

Thanks guys for the replies.
post #6 of 16
Quote:
Originally Posted by boohoo View Post
Ok I'm sort of confused.

Here's my motherboard: http://dh.mjsabby.com/mobo.jpg
Here's the case: http://www.newegg.com/Product/Produc...82E16811147042

Now, you guys are suggesting to not install the stock CPU cooler at all, just get the Thermaltake one, or the other one suggested by weltall and replace the intel fan. Right?
Well if you need a computer to use for the time being then yes install the stock intel hsf... If 3 ghz is your goal you will need AS5(artic silver 5 thermal compound) and an aftermarket hsf. The Tuniq or Thermalright Ultra extreme 120 are both top of the line air cooling solutions, though I would grab the thermalright over the tuniq(I have read of quality issues with respect to the tuniq).

Quote:
Secondly about the case fan, the Rosewill description says that there's place in the front for a 120mm fan, that I've ordered. I don't know if there's place for a side fan, it just seems like a vent.
You don't need a fan on the side duct, just make sure you put in 2 high cfm 120s(yate loons are cheap and effective). Also make sure to put them in a push pull config, where the front fan is an intake and the rear fan is an exhaust. Your PSU will also double as an exhuast fan.

Quote:
Also, no need for a nothbridge fan.

How do I cool the RAM, that's inserted vertically? there's a fan for those things as well?
The NB and Ram will be fine as they are, the e4400 @ 3.0 ghz will not strain the NB. Unless your pumping copius amounts of Voltage into your ram it will be fine with out any additional cooling.

Quote:
OCing is crazy exciting! I'm thinking I should first get the system completely up and running on the stock speeds and components, since these extra fans will take a few days to ship. Then OC it!

Thanks guys for the replies.
Definitely a wise aproach... OC'n should come after AS5 has set and overall system stability has been established @ stock settings.

GL
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post #7 of 16
Quote:
Originally Posted by boohoo View Post
Ok I'm sort of confused.

Here's my motherboard: http://dh.mjsabby.com/mobo.jpg
Here's the case: http://www.newegg.com/Product/Produc...82E16811147042

Now, you guys are suggesting to not install the stock CPU cooler at all, just get the Thermaltake one, or the other one suggested by weltall and replace the intel fan. Right?
We are suggesting to not install the stock heat sink and fan (it will keep you from being able to overclock) and to purchase an aftermarket heat sink and Fan for the CPU. The Northbridge can be cooled by an active fan and heatsink like that spirit II, or with just a large heatsink (Hr-05-SLI) that gets enough air moving across it from good case flow. Keep in mind the case flow depends on how good your fans are.
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post #8 of 16
Thread Starter 
Alrighty! That helps. But what do you mean by AS5 settling? Is this something in the heatsink world?

Secondly, is 2.0V copius amounts of voltage, considering that the GSkill 2x1GB has a 1.8-2.0v rating?
post #9 of 16
Quote:
Originally Posted by boohoo View Post
Alrighty! That helps. But what do you mean by AS5 settling? Is this something in the heatsink world?
"Mixing the resin Part A and the curing agent Part B begins a chemical
reaction that transforms the combined liquid ingredients to a solid. The time it
takes for this transformation is the cure time. As it cures the adhesive passes
from the liquid state, through a gel state, before it reaches a solid state.
"

"The warmer the temperature, the faster the adhesive will cure. The cure
temperature is determined by the ambient temperature plus the exothermic
heat generated during cure."

Rest can be found here:

http://www.arcticsilver.com/pdf/appi.../ins_aapxy.pdf

Quote:
Secondly, is 2.0V copius amounts of voltage, considering that the GSkill 2x1GB has a 1.8-2.0v rating?
2.0 vDIMM is no where near copious you won't need any form of additional cooling. Infact depending on your ICs(Integrated Circuits) if they are micron D9 they can handle 2.2 vDIMM fairly easily. If your g.skill memory is the HZ flavor then you have a good chance of having some nice D9 modules.
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post #10 of 16
Quote:
Originally Posted by MasterKromm View Post
"Mixing the resin Part A and the curing agent Part B begins a chemical
reaction that transforms the combined liquid ingredients to a solid. The time it
takes for this transformation is the cure time. As it cures the adhesive passes
from the liquid state, through a gel state, before it reaches a solid state.
"

"The warmer the temperature, the faster the adhesive will cure. The cure
temperature is determined by the ambient temperature plus the exothermic
heat generated during cure."

Rest can be found here:

http://www.arcticsilver.com/pdf/appi.../ins_aapxy.pdf



2.0 vDIMM is no where near copious you won't need any form of additional cooling. Infact depending on your ICs(Integrated Circuits) if they are micron D9 they can handle 2.2 vDIMM fairly easily. If your g.skill memory is the HZ flavor then you have a good chance of having some nice D9 modules.
NOOOOOOOO! Never use the AS5 (Arctic Silver 5) adhesive on a CPU!
Quote:
Arctic Alumina Thermal Adhesive IS NOT intended for use on a CPU. ONLY use Arctic Silver Thermal Compound on a CPU.
The epoxy stuff is for permanently attaching heatsinks to mosfets and small components that you never want to remove. Artic Silver 5 thermal compound is a grease that you must put between the CPU and the heatsink. It is used to transfer the heat from ther CPU die to the heatsink. Without it, the tiny air gaps between the CPU and heatsink (since they are not flat surfaces on a microscopic level) act as an insulator causing the CPU to overheat in a matter of a minute or less.
Here are the directions for the AS5 thermal compound (remember that thermal compound is always used, AS5 is just a popular brand).
Arctic Silver

And to answer your question on set times, according to the manufacture, it takes 200 power on-off cycles (heating up then cooling of the AS5) for it to properly set. Once it sets, after it sets, you will usually see a drop in temp by about 2-4°C.
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