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Do you overuse underuse or get it just right when applying thermal compound (on avrg) - Page 2

Poll Results: More, Less, or Just right?

 
  • 34% (21)
    I put too much.
  • 6% (4)
    I put too little.
  • 59% (36)
    I put just enough.
61 Total Votes  
post #11 of 30
I have found that less is best for temps..if you have a properly flat surface on the die/HS

For instance I use about 1/3rd what Fishie uses on the C2D/Q and it works much better than slathering it on..

I also rub it out with my bare finger...although it really does not seem to make a bit of difference--I have also tried just plopping the HS onto the bb of AS5 and twisting it to smoosh the paste out.

Either way upon removing the HS a while later the pattern is almost identical.

Too much TIM interferes with the heat transfer--it is only supposed to fill very small gaps--not be a layer...
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post #12 of 30
I suck at applying AS5. One of the main reasons I lapped my CPU + HSF -- no thermal paste needed.

But, my rig is acting funny and won't POST, so not that that matters anymore.
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post #13 of 30
I've set and re-set HSFs so often running this test or that experiment now, I guess I've developed a feel and technique for using TIM (doesn't matter which one now). My temperatures are bang-on-the-spot-dead-center consistent and predictable (given the variations in ambient temperatures), so I'll assume that I'm using just enough nowadays.

Practice makes perfect..?
    
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post #14 of 30
I use Ceramique and I just put a blob about the size of a bb and then slather it about with a plastic card. Been getting lower temps than just putting a bb size on and sticking the HSF on.
post #15 of 30
Quote:
Originally Posted by Fishie36 View Post
I got a few comments that I used too much but I'm really not sure. I did it exactly like the AS website said to.

That is way to much. When you are finished spreading the AS5 out, you should still be able to clearly see the IHS.
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post #16 of 30
You mean way too little?
post #17 of 30
Quote:
Originally Posted by pauldovi View Post
That is way to much. When you are finished spreading the AS5 out, you should still be able to clearly see the IHS.
Yeah but I don't spread it out. I followed the instructinos on the AS website.
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post #18 of 30
Quote:
Originally Posted by CyberDruid View Post
I have found that less is best for temps..if you have a properly flat surface on the die/HS

For instance I use about 1/3rd what Fishie uses on the C2D/Q and it works much better than slathering it on..

I also rub it out with my bare finger...although it really does not seem to make a bit of difference--I have also tried just plopping the HS onto the bb of AS5 and twisting it to smoosh the paste out.

Either way upon removing the HS a while later the pattern is almost identical.

Too much TIM interferes with the heat transfer--it is only supposed to fill very small gaps--not be a layer...
100% agree with CD...

Had a comp in just the other day, kept shutting down, the problem? Someone had put about half a cm thick layer of thermal paste on and the HSF wasn't able to cool the CPU...
    
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post #19 of 30
Check out this: http://www.overclockers.com/tips692/

What do you think of this technique? Scotch tape is thin enough?
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post #20 of 30
I do that one dot in the middle method and then when I go back to look it doesn't seem to be enough so I add some more.. then I look again and add some more again.. When I'm finally done, I usually add a bit too much :\\
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