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Freshly installed Zalman 9700 LED for my e4300

post #1 of 18
Thread Starter 
I have to say, this thing is awesome. It's looks awesome for one, was fairly easy to install even though you must remove the motherboard to mount the brackets, but I'm sure everyone already knows the details with this one so I'll just post temps at the highest clocks my motherboard will allow (sig)...

before @ 2.6GHz stock volts

38-42 idle
55-65 orthos load

after @ 2.6 stock volts

30-34 idle
42-48 orthos load

now I just need to lap, and my cooling should be ready for a 3.0GHz+ overclock with a new mobo. It only hit 48 for a split second, average load temps are approx. 44.
post #2 of 18
very nice I use to have that cooler & really liked it.
post #3 of 18
I keep seeing people talking about lapping. What does that mean?
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post #4 of 18
Quote:
Originally Posted by Eliphion View Post
I keep seeing people talking about lapping. What does that mean?
Its where you lap your heatsink lolz

Nah its where you get really fine sand paper and rub the base of the heatsink around and around until you've got a really smooth almost mirror reflective surface. Better Contact-To-Processor for better heat transfer and dissipation
    
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post #5 of 18
So, is it recommended? Or just for more "hardcore" OC'ers.

Thanks for explaining Nechen!
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post #6 of 18
Quote:
Originally Posted by Eliphion View Post
So, is it recommended? Or just for more "hardcore" OC'ers.

Thanks for explaining Nechen!
Well, overclocking itself is a bit of a risky thing altogether anyway. You're pushing your chips closer to their limits, certainly closer than they were at stock settings.

Lapping is an operation that is not without risk, especially on CPUs with pins. On a Socket 775 CPU, however, it's likely a lot less risky (since the pins are all on the socket itself, and not on the CPU).

The biggest risk to lapping an HSF's base is in doing it poorly. The object of lapping is to flatten the contact surfaces (the CPU's IHS -- Integrated Heat Spreader -- and the HSF's base) to facilitate optimal thermal transfer. The flatter these surfaces are, the fewer the peaks and valleys there are on them. These peaks and valleys are why you need Thermal Interface Material, incidentally (to fill these gaps and to eliminate air, which is a poor thermal conductor).

A poor lap job is one that isn't flat. The lapped surface may look shiny, but if it's not flat and is uneven then you actually have worsened contact between your surfaces.

The key, then, is to ensure optimal flatness. Go slow, take your time, and use a good technique. OCN has got many threads showing how to do a lapping job properly. Just use the Forum's Search Function.

Hope this helps you!
    
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post #7 of 18
Thread Starter 
Just woke up and temps are down in the 27-30 idle, 40-43 load at 29 ambient.I'll have to give it a few more days to "settle in", but I'm already impressed with this thing, even though I went against everyone's advice by buying this and not something else.
post #8 of 18
cool
    
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post #9 of 18
Quote:
Originally Posted by txtmstrjoe View Post
Well, overclocking itself is a bit of a risky thing altogether anyway. You're pushing your chips closer to their limits, certainly closer than they were at stock settings.

Lapping is an operation that is not without risk, especially on CPUs with pins. On a Socket 775 CPU, however, it's likely a lot less risky (since the pins are all on the socket itself, and not on the CPU).

The biggest risk to lapping an HSF's base is in doing it poorly. The object of lapping is to flatten the contact surfaces (the CPU's IHS -- Integrated Heat Spreader -- and the HSF's base) to facilitate optimal thermal transfer. The flatter these surfaces are, the fewer the peaks and valleys there are on them. These peaks and valleys are why you need Thermal Interface Material, incidentally (to fill these gaps and to eliminate air, which is a poor thermal conductor).

A poor lap job is one that isn't flat. The lapped surface may look shiny, but if it's not flat and is uneven then you actually have worsened contact between your surfaces.

The key, then, is to ensure optimal flatness. Go slow, take your time, and use a good technique. OCN has got many threads showing how to do a lapping job properly. Just use the Forum's Search Function.

Hope this helps you!
Awesome, thanks!
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post #10 of 18
Quote:
Originally Posted by Aaron_Henderson View Post
Just woke up and temps are down in the 27-30 idle, 40-43 load at 29 ambient.I'll have to give it a few more days to "settle in", but I'm already impressed with this thing, even though I went against everyone's advice by buying this and not something else.
Idle is 27-30 with 29 ambients? Impossible with air.
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