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post #101 of 129
Core = die

Most people lap the Integrated Heat Spreader
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post #102 of 129
Ok, but if the die\\core is what is in direct contact with the heatsink, then that is what you would polish. And if it designed to be in contact with the heatsink, then they would have designed it to withstand a good deal of pressure.

So, again I am still not understanding why the outcry.
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post #103 of 129
Quote:
Originally Posted by MadBan View Post
Ok, but if the die\\core is what is in direct contact with the heatsink, then that is what you would polish. And if it designed to be in contact with the heatsink, then they would have designed it to withstand a good deal of pressure.

So, again I am still not understanding why the outcry.
Because it challenged conventional wisdom.

The way I figure it, it's That_Guy3's CPU; he can do whatever he wants with it. It may be a good idea, it may be a bad idea, but without trying something and knowing for sure what will happen, everything is just conjecture.

For sure, this thread sure is entertaining...
    
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post #104 of 129
Thread Starter 
Quote:
Originally Posted by MadBan View Post
I guess I am not understanding everyones concerns.
I thought the whole point of lapping was to eliminate the imperfections on the surfaces of the CPU and heatsink that are in contact with each other.

This is what he did and now people are stating that he ruined the CPU due to him sanding an exposed core? He didn't touch the core... just the die.
they thought that I sanded the core.
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post #105 of 129
Thread Starter 
Quote:
Originally Posted by saxahonker View Post
Core = die

Most people lap the Integrated Heat Spreader
I just lapped the ugly color off the top basically so it's smooth.
the semprons don't have IHS
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post #106 of 129
Thread Starter 
I should have some high res pictures either really late tonight, or early tomorrow morning (sorry for the triple post)
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post #107 of 129
If anyone here has ever smashed up hardware they'll know that on Socket A CPU's the die is not exposed silcon. This is also the case with A64 dies. They have a thin sheet of metal covering the silicon etching.
    
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post #108 of 129
lapping can be done on the core of cpus that don't have an ihs. it's incredibly risky though
    
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post #109 of 129
Thread Starter 
Quote:
Originally Posted by mashersmasher View Post
lapping can be done on the core of cpus that don't have an ihs. it's incredibly risky though
you have to do it very lightly
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post #110 of 129
FYI, it the days of nonIHS cores, they were coated with a polyester resin like the kind used to make fiberglass products.... boats, Corvetts, etc...
Often it was not flat or square, thus the core lapping method which was common in the era. They were more prone to chip which was the common demise of the concept.
    
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