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Intel To Shrink Penryn For SFF

post #1 of 21
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Quote:
With the desktop PC market heading toward SFF (small form factor), Intel makes plans to shrink its newest Penryn processors.
Penryn will have two versions for its BGA packaging, LV and ULV, which will see die sizes shrink from the 35mm squared of previous Merom processors to 22mm squared. This will assist SFF products in becoming even smaller. Penryn will launch first as a 35mm square SV version in the second quarter of 2008 while the LV and ULV are scheduled for the second half.
Intel will launch its next generation Centrino platform, Montevina, in the second quarter of 2008. The platform will consist of 45nm Penryn processors, Cantiga GM/PM northbridge chipsets, and the ICH9M southbridge. The platform will also support the Wi-Fi/WiMAX wireless module codenamed Echo Peak, and the 802.11n wireless module codenamed Shirley Peak. Chipsets will support DDR2/DDR3 memory and the graphics engine will have built-in DisplayPort and HDMI/HDCP support, added the sources.
Source: Digitimes

Quite interesting........
    
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post #2 of 21
good read, and yet another shrink... whens it going to stop lol 22mm is crazy small
    
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post #3 of 21
It is just a die shrink and not a process shrink, right? It is still 65nm process? Since when is processor physical size ever an issue in SFF? Heat output and cooling takes up a lot more space.
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post #4 of 21
I'm going to start saving up. Hopefully I can get enough cash for one of the new cpus and gpus for around April - June time. =]
post #5 of 21
Uggh...This is disappointing. The problem approaching high-end PC cooling (Watercooling and even super-high end air) is that we can't extract any more heat from a given surface area as it is. Shrinking the available surface area makes our job even tougher.
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post #6 of 21
Quote:
Originally Posted by DuckieHo View Post
It is just a die shrink and not a process shrink, right? It is still 65nm process? Since when is processor physical size ever an issue in SFF? Heat output and cooling takes up a lot more space.
I think it's a 45nm process and that the die size (the middle of the chip when it's naked) will be smaller.

Quote:
Originally Posted by Burn View Post
Uggh...This is disappointing. The problem approaching high-end PC cooling (Watercooling and even super-high end air) is that we can't extract any more heat from a given surface area as it is. Shrinking the available surface area makes our job even tougher.
At least they're shrinking processes at the same time. This means it'll produce less heat!!
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post #7 of 21
Quote:
Originally Posted by ae804 View Post
I think it's a 45nm process and that the dye size (the middle of the chip when it's nakid) will be smaller.



Atleast they're shrinking processes at the same time. This means it'll produce less heat!!
IT'S A DIE! DAMMIT

DIE!
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post #8 of 21
Sorry I didn't look back over the post.

Fixed now.
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post #9 of 21
This isn't actually a process shrink; they're probably just removing a lot of cache in some of the processors to make the die size smaller. And remember, it will make it easier to cool, because it would take less voltage to run it at full speed.
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post #10 of 21
Quote:
Originally Posted by ae804 View Post
I think it's a 45nm process and that the die size (the middle of the chip when it's naked) will be smaller.



At least they're shrinking processes at the same time. This means it'll produce less heat!!
You are right, it is a 45nm process.

However, you are wrong about the process shrink. First, it doesn't say they are shrinking the process. Second, they just hit 45nm. The next process shrink isn't due for at least another year. Third, it also would be pointless to develop the same chip with two different process. Futher process shrinks aren't just optical shrinks but would require chip redesign.

I don't understand why they are making a smaller die when it has no real impact on SFF. Wow... I saved a whole 27mm^2 in my case! I can now fit in more... well, nothing.
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