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Intel To Shrink Penryn For SFF - Page 2

post #11 of 21
Quote:
Originally Posted by DuckieHo View Post
It is just a die shrink and not a process shrink, right? It is still 65nm process? Since when is processor physical size ever an issue in SFF? Heat output and cooling takes up a lot more space.
Better question, why don't we use 2 die on the same wafer?
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post #12 of 21
Quote:
Originally Posted by Licht View Post
Better question, why don't we use 2 die on the same wafer?
Because that just creates more heat. This small form factor's objective is to create small and cool chips.

If you just mean in general (and not just SFF chips), then you're talking about Intel's current Quad Core line up.
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post #13 of 21
Useless? Why shrink the die? They claim it will assist SFF to become even smaller but I fail to see it.
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post #14 of 21
Quote:
Originally Posted by Licht View Post
Better question, why don't we use 2 die on the same wafer?
There are hundreds of dies on a wafer....
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post #15 of 21
Quote:
Originally Posted by DuckieHo View Post
I don't understand why they are making a smaller die when it has no real impact on SFF. Wow... I saved a whole 27mm^2 in my case! I can now fit in more... well, nothing.
It's not the actual space of the die that means anything, but the cooling. If the die is smaller, smaller cooling can be used to get the same temperatures, and therefore everything is smaller.
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post #16 of 21
Quote:
Originally Posted by mentholmoose View Post
It's not the actual space of the die that means anything, but the cooling. If the die is smaller, smaller cooling can be used to get the same temperatures, and therefore everything is smaller.
Do not confuse process shrink and die shrink. TDP and heat output would still the same in a die shrink. It actually makes it hard to cool since there is more heat per area. It is easier to cool 100w of heat over 100mm^2 than 100 over 10mm^2
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post #17 of 21
Quote:
Originally Posted by Burn View Post
Uggh...This is disappointing. The problem approaching high-end PC cooling (Watercooling and even super-high end air) is that we can't extract any more heat from a given surface area as it is. Shrinking the available surface area makes our job even tougher.
All this may drive us out of a hobby/obsession with OCing
    
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post #18 of 21
Um, if they're not shrinking process and shrinking physical size, then they're removing transistors = less heat per mm^2. As if there's a lot of heat to begin with.....
post #19 of 21
Quote:
Originally Posted by DuckieHo View Post
You are right, it is a 45nm process.

However, you are wrong about the process shrink. First, it doesn't say they are shrinking the process. Second, they just hit 45nm. The next process shrink isn't due for at least another year. Third, it also would be pointless to develop the same chip with two different process. Futher process shrinks aren't just optical shrinks but would require chip redesign.

I don't understand why they are making a smaller die when it has no real impact on SFF. Wow... I saved a whole 27mm^2 in my case! I can now fit in more... well, nothing.
you can fit more dust particles?
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post #20 of 21
Quote:
Originally Posted by Pwnjohnson View Post
Um, if they're not shrinking process and shrinking physical size, then they're removing transistors = less heat per mm^2. As if there's a lot of heat to begin with.....
That would be a few hundred thousand to million transistors removed....

How can you just remove transistors and not call it new chip? Also, why not just remove these "extra" components from the desktop? Hmmm... why even include them?
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