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First Penryn Core 2 Chips Top At 3.33GHz - Page 4

post #31 of 61
Quote:
Originally Posted by cognoscenti View Post
Those Penryns will go nice in a X38 that hopefully supports Sli for 9800's
Damn you and being rich.
AMD :D
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AMD :D
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post #32 of 61
I will have to try at least one of these. The 12mb L2 cache may rock for folding. I realy hope that AMD has a chip that can be compared to it. I am not too concerned about gaming performance, but my hopes are that the Penryn is great and the AMD chip has magical folding powers.
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post #33 of 61
Quote:
Originally Posted by wire View Post
I hate this. How much you think one of those quads will cost? Now I wish I kept my computer and just saved up for this new stuff.
that's how I feel about my MoBo and DDR2... however it is always the case...

I think as long as you don't pay premium and OC well you are getting the best you can out of your $... give it a year and the 3.33GHz Quads will be garbage if the 8-cores run at 2.4GHz stock... just trying to make you feel better...(and myself too )
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post #34 of 61
Quote:
Originally Posted by saxahonker View Post
A Penryn is the 45nm shrink of the Core 2. Not quite different architecture.
Core 2 isn't a core. A Penryn is the 45nm shrink of the Kentsfield's. Wolfdale seems like it'll be the 45nm shrink of the Conroes. Allendales are dead then?

I find it a bit odd that intel is shrinking their Kentsfields before Conroes. Maybe its a sign that quadcore is becoming a standard? I personally think otherwise, so i'm really excited for the Wolfdales.
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post #35 of 61
good point! I am completely convinced that Quads will be standard by 2008... Duos will be single core of 2007... and the 8-cores will be the Quads of 2006...

we will see cores multiplying for a decade or two at least... after that there might be something different...? or well go to like 10nm chips and like 256 cores, hahaha muahahhaah MUAHAHAHAH!!!! lol
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post #36 of 61
Quote:
Originally Posted by trueg50 View Post
so are those "simulated speeds" or actual?
Those are actual speeds. Intel actually demonstrated these chips back in April...

http://anandtech.com/cpuchipsets/showdoc.aspx?i=2972

Quote:
Originally Posted by ryboto View Post
how different? I thought they were just adding SSE4 to Core 2 arch...

edit: and a die shrink..
Penryn is more than just a die shrink. Penryn introduces the worlds first 45nm Hi-k and metal gate process technology.

Quote:
Compared to today's 65nm technology, Intel's 45nm technology will provide the following product benefits:

  • Approximately twice the transistor density (great for smaller chip sizes or increased transistor counts)
  • Approximately 30 percent reduction in transistor-switching power
  • Greater than 20 percent improvement in transistor-switching speed or a greater than 5 times reduction in source-drain leakage power
  • Greater than 10 times reduction in transistor gate oxide leakage for lower power requirements and increased battery life
Quote:
The industry has been using silicon dioxide (SiO2) to build transistor gate dielectrics. Intel's SiO2 gate dielectrics, which have been the thinnest in the industry for the past 14 years, are now only 1.2nm thick (equal to 5 atomic layers) in our 65nm process. However, as the gate dielectric gets thinner, leakage increases. Transistor gate leakage associated with the ever-thinning gate dielectric made of SiO2 has been recognized by the industry as one of the most formidable technical challenges facing Moore's Law in this decade. Intel's solution is to move to alternate materials that are thicker to address leakage, yet at the same time preserve the high capacitance that is desirable for good transistor performance. This class of materials have a property known by the moniker "high-k." High-k, though, is not to be confused with low-k, which is being used to insulate on-chip interconnects. In transistor gate dielectrics, high-k is desirable as it gives high performance with low leakage; in interconnects, low-k is desirable as it leads to faster signal transmission times.

For its 45nm technology, Intel is using a hafnium-based high-k material in the gate dielectric. The high-k dielectric is created using atomic layer deposition (ALD) whereby a single layer of the high-k material molecule is deposited at a time. Because the high-k gate dielectric isn't compatible with today's silicon gate electrode, Intel had to develop the new metal gate materials to solve two fundamental problems that arise when the two are combined. One is known as "threshold voltage pinning" (also called "Fermi level pinning") and the other is "phonon scattering." Neither of these effects is desirable and both cause lower transistor performance. These effects arise when a high-k dielectric is used with a polysilicon gate electrode, but are significantly improved when polysilicon is replaced by specific metals (different ones for NMOS and PMOS transistors), and all are integrated with the right process recipe. (The specific metals are a trade secret.)

The combination of the metal gates and the high-k gate dielectric leads to transistors with very low current leakage and high performance.
Intel will use copper wires with a low-k dielectric for its 45nm interconnects for increased performance and lower power consumption. We will also use innovative design rules and advanced mask techniques to extend the use of 193nm dry lithography because of its cost advantages and high-volume manufacturing capabilities.
http://www.intel.com/technology/sili...view+body_45nm

The Hi-K technology is quite revolutionary. It will allow for significantly more efficient CPUs out of the Core 2 and Core 3 architecture. Facts about 45nm Hi-k.

However, Intel also introduces full SSE4 multimedia instructions, several new power saving features, and the ability to clock each individual core.

Penyrn will be quite the chip before Nehlam.
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post #37 of 61
Quote:
Originally Posted by gwidion View Post
3.33ghz stock!?!?!?!?

we might be seeing 5ghz if these things OC well.
No. Heat is still a compounding issue. But Intel claims they can do 3.9ghz stock, so ~4.5ghz overclocks *might* be possible on high-end air. Gotta remember that these are quads, and quads generate a lot more heat than duos. You might be able to get a single core to 6 ghz, but you should be aiming for all cores being 100% stable.

Quote:
Originally Posted by ryboto View Post
how different? I thought they were just adding SSE4 to Core 2 arch...

edit: and a die shrink..
Yeah, that's it. Die shrink, new materials with less leakage.
     
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post #38 of 61
Quote:
Originally Posted by USlatin View Post
that's how I feel about my MoBo and DDR2... however it is always the case...

I think as long as you don't pay premium and OC well you are getting the best you can out of your $... give it a year and the 3.33GHz Quads will be garbage if the 8-cores run at 2.4GHz stock... just trying to make you feel better...(and myself too )
I can only wait till Octo-Core cpus....*drools*
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post #39 of 61
Quote:
Originally Posted by cognoscenti View Post
Those Penryns will go nice in a X38 that hopefully supports Sli for 9800's
I'm pretty sure Nvidia's December chip isn't named 9800.
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post #40 of 61
If these are coming out in Q4, and Nehalem is coming out Q3 08 (guess) with probably a new socket, why the hell would someone buy a penryn? I'll rephrase that, why would anyone with a Core 2 system upgrade to penryn when Nehalem and better DDR3 is around the corner.
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