Latest TekFrame Victim: DFI UT P35 T2R LanParty - Page 2

It will still be a few days. I have a project I am in the middle of (as usual) so it must wait for a bit--need a CPU anyway

Well that was quick--G0 Q6600 from Club it arrived and I popped it in.

The whole transpiper thing is kind of wierd. I'll post some shots of what I did. First of all Hot air from a PSU blowing on it is not my idea of 1337 cooling. Now this is on a tech station--but I am just thinking out loud about the suggested installation method.

Second thought--the contact zones between the heatpipes are really small--even though no mention of TIM was in the handbook I used some Shin there at the connection points. First I tried it on the ICH9R and kept my hand on the Mosfet sink and could tell it was doing nothing to cool the whol heatpipe assembly.

I then dug through the parts bin and found an AMD heatsink and popped off the Nidec and Viola it was perfect for the Transpiper. I removed the silly metal bracket from the transpiper and used just the wire clips --which mated perfectly to the 60mm Nidec.

Within a few moments a hum was coming from the whole motherboard--the transpiper was vibrating and translating it all through the mobo...

Now DFI provides what appears to be a copper plate to fit between the IHS and HS--again this is not my idea of 1337 cooling--heat from the CPU would be going directly to the mosfets and vice versa--just does not seem to make sense to me--so I used the other smaller plate provided which happens to have holes in the exact same location as the holes in the copper plat and mosfet sink. Hmmmm.

Even though DFI never mentions this option it seems to be the best way to go--the Mosfet sink gets really hot--hotter than the SB or NB and now it has the most direct connect to the Transpiper. I also found it od that DFI does not show the use of TIM between the copper plate and IHS n the CPU--only the copper plate and the HS...that makes no sense to me--but perhpas the crush of the HS would conform that thin apparently copper plate to the IHS. I may try that later--but TBH unless I were using Phase or a chiller I would still want the CPU to get all the cooling power.

Right now the Transpiper is hanging out the backplane and off to the side away from the mobo sucking nice cool air in with the lil Nidec. The vibration is much less in this arrangement for some reason. No comment on whether or not this conglomaration of heatpipes are really doing anything. I also have a fan blowing right on the RAM/NB sink and with a similar arangement and speeds and volts the INfinity was about the same temps. Except the B3 was hotter,

Taking a stab at the settings (having some notes from the Infinity) I was able to boot right up at 3200 (8 x 400) and am Folding now at 30C. The PWM is 38C and the Chipset is 35C.

CPU Voltage in Smart Guardian is reported at 1.34 (Intel spec is 1.35 max) so I feel that it may be too high for this OC. The FSB VTT is 1.37 NB Core is 1.43 reported.

I have no doubt I could lower all the voltages--but temps are low and for right now I will let it Fold.

Seeing 28C-30C with G0 as it burns in the Shin--this is alomt 10C lower than the P5K /B3 Q6600 running dead stock.

I was plenty happy with the P5K/B3 until I see this in action. I had no idea I could be overvolted and overclocked and running at 28C... with ambient temps of 24C...

That's only 4C over ambient at load! I thought that 5C over was good...wow.

You been peeping through my windows???

Let me post up some shots from tonight...

If only I knew what the hell I was doing

Been re-reading the thread over at XS--it's a wealth of info on this board. However I have found that one person's golden settings are not necessarily another's. Despite having nearly identical hardware to some of those posting up settings I have not had great success with using their finds.

I dunno--the Chipset and PWM are reading in the 30's so no complaints from me. I have not used the odd metal plate they suggest sandwiching between CPU and Heatsink...but I betcha with phase that would do a lot to increase headroom by keeping the whole mobo chilled.