Originally Posted by Skullzaflare
how would you get the heatdsink on before the solder cooled to solid? i had this issue earlier today bonding 2 wires
Originally Posted by blupupher
Would not be that hard. Just heat the HSF up to melt the solder and then stick the CPU on it. You really would not need to mount it since the solder would hold it in place (unless you have a real heavy HSF setup).
I guess you could mark where the CPU needs to be and solder it that way also.
thats what i was thinking, but you have to keep in mind HS job is to move heat away, so the very second you remove the heat that solder will solidify
Originally Posted by johonm333
I have to say that this is the FIRST time i have heard this question.
I would say to use more than a typical thermal paste job, because THEN you are filling in more of the rougher/rounded areas.
A steady hand with plenty of time and you might break a world record(for AIR that is...) with a good chip!
not sure what made me think of it, and i dont think it would be limited to air, infact i think it would be better on water since it can remove the heat transfered faster
the real question though is whether solder really would transfer heat faster than as5, i imagine it would considering its a solid
and then the bigger issue is getting the cpu in the right place on the sink, its one thing if its adjustable, but a lot would need it in EXACTLY the right place