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Lapping your CPU and Heatsink - Page 19

post #181 of 188
just finished lapping my x5470 following this guide. my temps were a lot higher than what everybody was reporting with similar overclocks. i noticed when i removed my air cooler to switch to a aio water cooler that the tim on the ihs was not covering about a 1/2 inch square in the center. after lapping my temps dropped 14c. it must have been pretty warped. thanks much for this guide.
post #182 of 188
I can't find any isopropyl, would mineral turpentine un1300 or methylated spirits 85% ethanol un 1170 work?
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post #183 of 188
Quote:
Originally Posted by Curleyyy View Post

I can't find any isopropyl, would mineral turpentine un1300 or methylated spirits 85% ethanol un 1170 work?

Dang, you can't just run to a drug store right quick? Here we have Walgreen's/CVS/Walmart etc. all carry isopropyl for use as an anticeptic. I would be worried about the items you listed leaving a residue, which would impede performance.
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post #184 of 188
I was able to find this ( http://www.jaycar.com.au/productView.asp?ID=NA1066 ) and there's a store down the road, is this the type I'm after?
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post #185 of 188
That's the one smile.gif
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post #186 of 188
i lapped my PC like 1-2 months ago..i got 5C drop on the CPU, 7C drop on the chipsets, and unknown biggrin.gif on the VRM
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post #187 of 188
This topic is of great interest as I am about to build a 6700K rig - parts on the bench just waiting for the rest to arrive. However I have a fairly new little box with an i3 4170 used for another purpose. That little box is in a reused case using the I3 internal for Graphics and is totally passively cooled with a Deep Wind Ice Wind Pro. The way that is done is by using cut up bits of card to ensure that there is no airflow coming in adjacent to the tower cooler - blocked the back plate holes in that area and then the card forces the power supply fan to draw through the cooling tower.

When it was assembled it was put together with Zalman ZM STG1 paste. Prime 95 temps maxed out @ 75 degrees.

Last night I took it apart and pulled out a straight edge and checked the cooler base. Now Deep Cool Claim all sorts of things for their technology including a claim of perfectly flat base. Well that turned out to be fiction. Its fairly flat but no where near actually flat. So out came a flat file and a few minutes later the base was flat. I couldn't bring myself to take to the cpu with the file ..... yet .... Reassembled using AS5 which apparently needs a few hours to settle in temps are down to ambient @ idle and 72 degrees Prime 95 and under load will possibly go lower yet under load. Cant be lower than ambient under no load and it didn't used to be quite that low.

Now the interesting thing is that a heavy flat file used carefully will not product a mirror finish like lapping will but it will produce a very accurate flat finish in a fraction of the time that lapping does. So the technique used was to have the file held on a flat surface and then with fairly light pressure draw the heat sink base across the file - files only cut in one direction. So the 6700K will be assembled and run for a while to make sure the chip is good. Then I intend to take to both the cooler and chip with a file because the result will be at least as flat as using sand paper and lapping but in a fraction of the time and with a fraction of the effort. The key being a decent sized heavy flat file because it needs to be wide enough that what is being drawn across it is largely totally supported so does not rock.

Another, but much faster way of doing the job.
post #188 of 188
So moving forward. Still waiting for the 6700K parts, I have done some more work with air flows on the 4170 as well as gently swiveling from side to side to if you like allow the HS to better settle. The thought is that after the 5 or 6 hours of use including a couple of temperature cycles that it might better mate the surfaces.

As well as that some more effort to better direct airflow within the case and keep in mind the only fan in the entire system is that in the Power Supply Unit..

So temps @ 100% Load for 36 mins are now down @ 64 degrees max. Currently 61 degrees on one core and 59 degrees on the second. 4 threads running though.

I reckon that is a pretty good result for a few minutes with a File and some care with ducting the air flow. This is a dual core Intel Processor with a Heat Sink with no fan on it also doing the graphics at 100% load.

So here is my take on the improvement from the prework temps. And keep in mind they were still in the same case with no active cooling. So 75 degrees to 64 degrees. And my view is subjective because I cant prove what each step made as a difference.

1. 50%. Improving the airflow through the cooler. Just ducting it better and drawing from the front of the case thereby reducing the re circulation.
2. 25% Filing the base of the cooler so it was really flat.
3. 10% moving from Zalman to AS5
4. 15% moving the cooler around without demounting it to mate the surfaces better after a period of time.

And by the way, now up to 44 minutes and still max temp of 64 degrees. Currently 61 and 58 degrees. So whatever the reason given that I have not changed a single component and dont have a cooling fan in the system its still a stellar result. Today under normal load, still with no cooling fan, it didnt exceed 44 degrees.

So my next experiment because I need a low powered cooling solution to set up the new motherboard is going to be to take to a standard Intel i3 cooler and see if I can make it cool the 6700K well enough to set it up. BUT not overclock it. I just need to make sure that the OS and every bit of software will work before I install it as the main machine. Interestingly I have stuck a straight edge on the I3 cooler already and its not bad. Not flat but much better even though it only looks cast than the Deep Cool Ice Wind Pro.
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