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[hexus] 9800 GX2 @ CeBIT - Page 7

post #61 of 66
Quote:
Originally Posted by joemaniaci View Post
Yes, I guess I just pulled this out my ass, whos to say nvidia couldn't implement the same thing.
http://www.neoseeker.com/Articles/Ha...ews/asusp5ld2/
Seriously? If you want to keep throwing random arguments with no bearing on the situation at hand go ahead, but it will just frustrate you more when I respond...

First off, I don't see any mention of Nvidia doing the extra layer of metal. Second off, you just proved my point that metal is a better conductor of heat that PCB, and therefore disproved your point that the extra PCB would help. In other words, it would be better if the entire PCB were metal (heat dissipation-wise), which means that the PCB would be better replaced with a heat sink to dissipate more heat. Since the PCB takes up space that a heat sink could otherwise occupy, the card will be worse off because of it.

Quote:
Originally Posted by binormalkilla View Post
THat's what I'm thinking about.........I mean it seems that it would be really hard to create an efficient waterblock for this card, as the GPUs are parallel to each other instead of in series.......



While I agree that the dual PCB is a very poor design, you would be surprised......a PCB can actually conduct heat more than you would think. I mean the only benefit of the dual PCB design that I can think of is that the VRMs will be on different PCBs, thus they can't bleed onto each other when being overvolted.
They face each other on the card. They have no choice but to bleed onto each other regardless, except now there is less space for the cooler to dissipate that heat energy.
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post #62 of 66
man forget this, i want the 9xxx series version of the 8800 GTS 512 mb, thats it, non of this sandwiched "innovative" monstrosity
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post #63 of 66
Quote:
Originally Posted by Newms118 View Post
man forget this, i want the 9xxx series version of the 8800 GTS 512 mb, thats it, non of this sandwiched "innovative" monstrosity
It appears that the 9000 series for Nvidia is a rebranded 8000 series, at least for their high-end solution.
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post #64 of 66
Quote:
Originally Posted by stargate125645 View Post
Seriously? If you want to keep throwing random arguments with no bearing on the situation at hand go ahead, but it will just frustrate you more when I respond...

First off, I don't see any mention of Nvidia doing the extra layer of metal. Second off, you just proved my point that metal is a better conductor of heat that PCB, and therefore disproved your point that the extra PCB would help. In other words, it would be better if the entire PCB were metal (heat dissipation-wise), which means that the PCB would be better replaced with a heat sink to dissipate more heat. Since the PCB takes up space that a heat sink could otherwise occupy, the card will be worse off because of it.

They face each other on the card. They have no choice but to bleed onto each other regardless, except now there is less space for the cooler to dissipate that heat energy.
I think you missed my point....a PCB will dissipate the heat of the IC that resides upon it radially......it doesn't just go in one direction. PCB with more layers is always better for heat dissipation.
Obviously metal has a higher thermal conductivity than PCB material, as PCB is made primarily of insulating materials.....I don't think anyone would argue that.
I'm more designed with the fact that the GPUs are directly parallel to each other rather than in series, as the heat will build up and bleed between each GPU across the small amount of aluminum between them....NVidia could have at least offset the GPUs by a few inches to distribute the area of the heatsink better....
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post #65 of 66
Quote:
Originally Posted by binormalkilla View Post
I think you missed my point....a PCB will dissipate the heat of the IC that resides upon it radially......it doesn't just go in one direction. PCB with more layers is always better for heat dissipation.
Obviously metal has a higher thermal conductivity than PCB material, as PCB is made primarily of insulating materials.....I don't think anyone would argue that.
I'm more designed with the fact that the GPUs are directly parallel to each other rather than in series, as the heat will build up and bleed between each GPU across the small amount of aluminum between them....NVidia could have at least offset the GPUs by a few inches to distribute the area of the heatsink better....
But for all intents and purposes only the interior portion is dissipating heat effectively, and the major components are facing each other so my point still stands.
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post #66 of 66
absolutely amazing
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