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Lapping and Thermal Compound Questions

post #1 of 10
Thread Starter 
Hi, I am yet to see a post where lapping and the use of a thermal compound are together. I have searched but missed it I guess.

So..... lets say I lap the HS and the CPU, does one still apply a compound?

On a Quad-Core Q6600, how much?

I can contribute that Radio Shack carries a Ceramic and a Silver compound in the store if you do not want to wait for the UPS truck.

thanks
    
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post #2 of 10
You still use thermal paste. You use very little, a half the size of a bb drop in the middle of the cpu should work fine. Or since the Quad sets up 2 in a row, you could do a line down the middle of the cores, but that always ends up being too much. I say stick with the very tiny bit in the middle. It will press out and fill the miniature scratches that we can't see with bare eyes, thus making contact even better. Just remember, about half the size of a bb or half the size of a grain of rice. DO NOT OVER DO IT! Haha, it would just make the lapping pointless!

Try searching some guides on OCN. The search engine kind of sucks right now, but with enough looking in the right sections, you should be able to locate some helpful information. Feel free to PM me or any other member with detailed questions, most of us are glad to help.
    
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post #3 of 10
Thread Starter 
Thanks
    
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post #4 of 10
Quote:
Originally Posted by l V l View Post
You still use thermal paste. You use very little, a half the size of a bb drop in the middle of the cpu should work fine. Or since the Quad sets up 2 in a row, you could do a line down the middle of the cores, but that always ends up being too much. I say stick with the very tiny bit in the middle. It will press out and fill the miniature scratches that we can't see with bare eyes, thus making contact even better. Just remember, about half the size of a bb or half the size of a grain of rice. DO NOT OVER DO IT! Haha, it would just make the lapping pointless!
+1 on this, it took me at least three or four applications over the span of several months before I realized that less is more when using this stuff - especially on a lapped IHS + HS combo...
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post #5 of 10
Quote:
Originally Posted by 2therock View Post
Thanks
Glad that I could help. Seems your relatively new to OCN, so you may not be used to the extreme helpfulness people carry here.
    
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post #6 of 10
Basically, the smoother the surfaces, the less deformaties that the TIM needs to fill in. You still need it, but much less than normal. I usually apply some and mount the HS or block, then remove to see the "spread".
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post #7 of 10
Quote:
Originally Posted by dralb View Post
Basically, the smoother the surfaces, the less deformaties that the TIM needs to fill in. You still need it, but much less than normal. I usually apply some and mount the HS or block, then remove to see the "spread".
If you got it oozing out the sides as spread, you got too much.
    
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post #8 of 10
Quote:
Originally Posted by l V l View Post
If you got it oozing out the sides as spread, you got too much.
lol, yeah. I usually try to get a nice circle in the middle similar to the size of the contact patch on a stock intel cooler. Having a bowed D-Tek helps a little too. I try to use as little as possible and that is the best way I have found. Once I get used to how much that particular HS or block needs, its not an issue, but when trying something new (HS or newly lapped HS) it helps.
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post #9 of 10
Thread Starter 
Good Stuff Guys,

I want to continue with another observation......

Looking into the thermal paste for the first time I stumble into a Arctic Silver Vs. Ceramique thing.
The silver is supposed to contain a metal that will conduct voltage and the Ceramique does not. Some say the only thing to fear with the silver is dripping it on the Mobo and shorting. But geesh, thats being careless.
So I go to Radio Shack today and they have both on the shelf Branded
"Thermaltake" Compound # CR (ceramique) and #AS (silver).
Inside both packages are Arcticsilver products. Both the thermal conductivity numbers say 8.7/w/mk.
The silver is twice the price so I get both. I get home and visit arcticsilver.com and get the specs on both.

Thermal Conductance:
(Silver) >350,000W/m2 °C (0.001 inch layer)
(Ceramique)>200,000W/m2.°C (0.001 inch layer)
Thermal Resistance:
(Silver)<0.0045°C-in2/Watt (0.001 inch layer)
(Ceramique)<0.007°C-in2/Watt (0.001 inch layer)
Average Particle Size:
(Silver)<0.49 microns <0.000020 inch
(Ceramique)<0.38 microns <0.000015 inch
( 67 particles lined up in a row equal 1/1000th of an inch. )
Extended Temperature Limits:
(Silver) Peak: –50°C to >180°C Long-Term: –50°C to 130°C
(Ceramique) Peak: –150°C to >180°C Long-Term: –150°C to 125°C

The silver takes up to 200 hours and several temp cycles where the computer is turned off and let cool to room temps to get to the maximum conductivity.

Later,
    
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post #10 of 10
I know this is an old thread, but I saw some promising results WITHOUT using any compound. Of course I went all the way to 2000 grit paper...

Anyway, now that I know that I am SUPPOSED to use thermal compound I will let you know how it does in perspective.
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