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Researchers at Purdue University and Intel have developed heat dissipation technology that can boost the performance of chip-cooling systems by up to 200 percent.
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"To date, we have demonstrated that the technology can enhance fan cooling by more than 200 percent," said Suresh Garimella, professor at Purdue University, who is also a researcher on the project.
Current air-cooling technology is attractive because of its cost advantages and ease of implementation, Garimella said. However, fans and heat sinks can't manage all the heat generated by chips.
Ionic wind engines can be placed on a chip or a laptop to complement the current air-cooling technology to better manage heat dissipation, avoiding the need to switch to alternative, costlier cooling approaches such as liquid cooling, Garimella said.
"The ionic wind technology we are developing is designed to work in addition to conventional fan-driven methods, not necessarily as a replacement for current systems," Garimella said.
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Armored MeDuSa
(13 items)
 
  
CPUMotherboardGraphicsRAM
Q9450 ASUS Striker II Extreme 790i eVGA 9800GTX OCZ (2*2) 4GB DDR3 1333MHz 
Hard DriveOptical DriveOSMonitor
RaptorX 150GB, 2*7200.11 1TB 2*Samsung DVD-RW Vista Ultimate SP1 64Bit Samsung 2232BW 22" Widescreen 
KeyboardPowerCaseMouse
Microsoft Ergonomic Desktop 7000 Enermax Galaxy 1000W DXX Armor+ Microsoft Ergonomic Desktop 7000 
  hide details  
Reply