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Is this necessary when applying MX-2

post #1 of 14
Thread Starter 
Is it necessary when applying MX-2 Thermal Compound to spread it around after you put the bb sized drop in the middle of the cpu? This is for a dual core cpu.
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post #2 of 14
In a diagonal line and start spreading until you cover the CPU. Use about a half grain of uncooked rice.
post #3 of 14
http://www.arcticsilver.com/pdf/appi..._dual_wcap.pdf

That is the installation instructions for intel dual cores. Hope it helps
post #4 of 14
Thread Starter 
Isn't there a difference between as5 and mx2?
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post #5 of 14
Quote:
Originally Posted by Vitaminx View Post
Isn't there a difference between as5 and mx2?
plenty of them... but they're still both thermal compounds and just about all can be applied the same way... I've used both the "line" method with a mechanical pencil tip and the "dab and spread" method... I personally like the latter and believe it gives better thermal performance...

just put a few VERY VERY small dabs all over the place and spread it around with your finger in a plastic bag... then add a VERY small bead at the center...
my temps with this method @ stock:
http://i6.photobucket.com/albums/y20.../temp_idle.jpg
http://i6.photobucket.com/albums/y20.../temp_load.jpg
post #6 of 14
i like the rice method
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post #7 of 14
Just don't spread the paste across the whole IHS. You get better temps with the Dot in the middle or grain of rice method, either or.
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post #8 of 14
Quote:
Originally Posted by alexgheseger View Post
Just don't spread the paste across the whole IHS. You get better temps with the Dot in the middle or grain of rice method, either or.
This is the way I view thermal paste and heat transfer:


Since most CPUs and Heatsinks are not perfectly flat (even when lapped), the thermal paste (if only added at the center) will only spread to cover a portion of the IHS.... although the majority of the heat from the core DOES concentrate at the center of the IHS, some of the heat also finds itself at the edges of the IHS (where there is a gap and no contact due to a lack of thermal paste)....

Although the general argument is that less thermal paste = more contact between the ACTUAL surfaces... I believe that pre-spreading would allow for a contact between the unavoidable gaps at the edges of the CPU's IHS and Heatsink.... and therefore would allow for more heat transfer to the HSF
post #9 of 14
Thread Starter 
interesting work there
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post #10 of 14
May i note that the half a grain of uncooked rice is most likely only suitable for a lapped CPU going onto a lapped heatsink, otherwise its not going to be enough

Coolers like the AC7 have such fine grooves in them, that they actually make a wiki wiki sound if you run your nails over the bottom, half a grain of rice worth of thermal compound will be not enough by far
    
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