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Is this necessary when applying MX-2 - Page 2

post #11 of 14
Thread Starter 
so...put bb size drop in middle then put finger in plastic bag then spread it around a little bit. keep in mind this is mx2 and not as5, so it spreads a lot easier.
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post #12 of 14
Quote:
Originally Posted by killa_concept View Post
This is the way I view thermal paste and heat transfer:


Since most CPUs and Heatsinks are not perfectly flat (even when lapped), the thermal paste (if only added at the center) will only spread to cover a portion of the IHS.... although the majority of the heat from the core DOES concentrate at the center of the IHS, some of the heat also finds itself at the edges of the IHS (where there is a gap and no contact due to a lack of thermal paste)....

Although the general argument is that less thermal paste = more contact between the ACTUAL surfaces... I believe that pre-spreading would allow for a contact between the unavoidable gaps at the edges of the CPU's IHS and Heatsink.... and therefore would allow for more heat transfer to the HSF
Well, yes and no. The problem with the spread method is that you can introduce little air bubbles if you're not careful. I find your best bet is a line of thermal paste that is just enough to cover the IHS when squished down.
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post #13 of 14
lap both surfaces perfectly flat.
use 4 very small dabs(least you cna get out of the tube basically) and place it around the border of the IC.

no air bubbles, ensures decent spread, and doesn't use so much paste that it doesn't act as a thermal impeder
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post #14 of 14
Thread Starter 
I'll probably just do a bb sized drop on the center of the processor. Good enough?
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