Overclock.net › Forums › Industry News › Hardware News › [Science Blog] Tiny bubbles key to future liquid-cooling
New Posts  All Forums:Forum Nav:

[Science Blog] Tiny bubbles key to future liquid-cooling - Page 3

post #21 of 33
Quote:
Originally Posted by nathris View Post
No but you could cool a Q9450 with one...


With 45nm here and 32nm on the way watercooling is becoming obsolete. Its expensive, risky, and high maintenance, while providing little improvement over quality air. Newer chips are hitting voltage walls before they overheat and this trend will continue until at least the switch to carbon nanotubes.

I wouldn't be surprised if the 22nm low end processors won't even need heatsinks.
Totally Wrong...


What they are saying is 300 watts PER INCH? SQUARE. SQUARE being importance... Its the AREA not the total output...

That being said... It means that there is going to be MORE HEAT PER INCH?
That means that we will need to transfer more heat in smaller areas....
    
CPUMotherboardGraphicsRAM
Q8300 @ 3.0Ghz EP45-DS3L Saphirre 5770 Vapor-X 6 gig A-Data 800mhz (2x2 + 2x1) 
Hard DriveOptical DriveOSMonitor
OCZ Vertex 2 60Gig + 4.5TB worth of drives Samsung Windows 7 Ultimate 64-bit 2xAsus VW266H 25.5" 
KeyboardPowerCaseMouse
G110 650W Cooler Master Antec 300 G500 
Mouse Pad
Razer pad 
  hide details  
Reply
    
CPUMotherboardGraphicsRAM
Q8300 @ 3.0Ghz EP45-DS3L Saphirre 5770 Vapor-X 6 gig A-Data 800mhz (2x2 + 2x1) 
Hard DriveOptical DriveOSMonitor
OCZ Vertex 2 60Gig + 4.5TB worth of drives Samsung Windows 7 Ultimate 64-bit 2xAsus VW266H 25.5" 
KeyboardPowerCaseMouse
G110 650W Cooler Master Antec 300 G500 
Mouse Pad
Razer pad 
  hide details  
Reply
post #22 of 33
By the time that becomes an issue, they won't be using silicon based chips anymore.
In Progress...
(13 items)
 
  
CPUMotherboardGraphicsRAM
Q6600 G0 @ 3.6GHz DFI DK P35-T2RS Dark PowerColor 6870 OCZ Reaper 2 x 2 GB 
Hard DriveOSMonitorKeyboard
Too Many Windows 7 Pro x64 Samsung 2333SW Logitech G15 
PowerCaseMouseMouse Pad
PC Power & Cooling Silencer 750W Quad Antec 900 Razer Death Adder Razer Goliathus Control Edition 
  hide details  
Reply
In Progress...
(13 items)
 
  
CPUMotherboardGraphicsRAM
Q6600 G0 @ 3.6GHz DFI DK P35-T2RS Dark PowerColor 6870 OCZ Reaper 2 x 2 GB 
Hard DriveOSMonitorKeyboard
Too Many Windows 7 Pro x64 Samsung 2333SW Logitech G15 
PowerCaseMouseMouse Pad
PC Power & Cooling Silencer 750W Quad Antec 900 Razer Death Adder Razer Goliathus Control Edition 
  hide details  
Reply
post #23 of 33
Quote:
Originally Posted by Coma View Post
How did they get to the four times hotter conclusion? It's only been getting cooler...
thats what i was thinking

smaller fab process means smaller wires means less energy required (watts) meaning less heat generated, not more. The only thing I can think of is if the amount of added cores to a single die increases faster than the required energy drops.
Sager NP5165
(7 items)
 
 
CPUGraphicsHard DriveOptical Drive
I7 2630QM Nvidia Geforce GT 555 Hitachi BLU-RAY 
MonitorMonitorMouse
1080p Matte 95% Color Gamut Yamakasi Precision 2703 LED IPS Microsoft Sidewinder 
CPUMotherboardGraphicsRAM
Opteron 170 DFI NF4 Ultra-D 8800GTS 4x1GB GSkill 500mhz HZs 
Hard DriveOptical DriveOSMonitor
160GB + 120GB LiteOn LiteScribe DVD burner Windows 7 Home Prem. Samsung 220WM 22" + LG f-Engine 17" (dual screen) 
KeyboardPowerCaseMouse
HP Internet/Media Keyboard Ultra 600W AeroCool AeroEngine II. Rice for computers Logitech LX7 
Mouse Pad
Belkin with Gel Wrist Pad 
  hide details  
Reply
Sager NP5165
(7 items)
 
 
CPUGraphicsHard DriveOptical Drive
I7 2630QM Nvidia Geforce GT 555 Hitachi BLU-RAY 
MonitorMonitorMouse
1080p Matte 95% Color Gamut Yamakasi Precision 2703 LED IPS Microsoft Sidewinder 
CPUMotherboardGraphicsRAM
Opteron 170 DFI NF4 Ultra-D 8800GTS 4x1GB GSkill 500mhz HZs 
Hard DriveOptical DriveOSMonitor
160GB + 120GB LiteOn LiteScribe DVD burner Windows 7 Home Prem. Samsung 220WM 22" + LG f-Engine 17" (dual screen) 
KeyboardPowerCaseMouse
HP Internet/Media Keyboard Ultra 600W AeroCool AeroEngine II. Rice for computers Logitech LX7 
Mouse Pad
Belkin with Gel Wrist Pad 
  hide details  
Reply
post #24 of 33
Quote:
Submitted by BJS on Mon, 2003-04-14 10:15.
its talking about heatpipes...
    
CPUMotherboardGraphicsRAM
Intel Centrino T2300 @ 1.83 GHz Intel GM945 Express Chipset Intel GMA950 2x1GB PC2-5300 667MHz 
Hard DriveOptical DriveOSMonitor
250GB 7200rpm WD Scorpio Black USB External DVD/CDRW Windows XP Pro SP3 12.1" 1024x768 DVI 
PowerCaseMouse
4400mAh Li-ion (7+ hours on power saving profile) Carbon Fibre with Magnesium alloy roll cage IBM Trackpoint 
  hide details  
Reply
    
CPUMotherboardGraphicsRAM
Intel Centrino T2300 @ 1.83 GHz Intel GM945 Express Chipset Intel GMA950 2x1GB PC2-5300 667MHz 
Hard DriveOptical DriveOSMonitor
250GB 7200rpm WD Scorpio Black USB External DVD/CDRW Windows XP Pro SP3 12.1" 1024x768 DVI 
PowerCaseMouse
4400mAh Li-ion (7+ hours on power saving profile) Carbon Fibre with Magnesium alloy roll cage IBM Trackpoint 
  hide details  
Reply
post #25 of 33
Quote:
Originally Posted by lordikon View Post
The same amount of heat in a smaller area would make it harder to cool. This is actually not the case. The e8400 is almost too easy to cool, which is why people are over-volting them so easily rather than overheating them. Voltage decreased with the e8400s by quite a bit. You'll notice these chips come with a tiny aluminum heatsink. This isn't because they run hot, they run much much cooler than than a P4 from 2 years ago, and no, their die size is not much smaller. CPU die sizes aren't much different than they were 5-10 years ago. My P3-500 celeron from 11-12 years ago had a die size about the same as my current e8400.
A P3-500 celeron disipates quite a bit less heat than an E8400, even as efficent as the latter chip is. So, heat density has increased, along with transistor density. Stating their dies are of similar size is true, and this is precisely what proves my point. A 500MHz P3 celeron is a ~25w chip. An E8400 is 65w.

Right now, copper has low enough thermal resistance and high enough thermal conductivity to work with current transistor/heat densisity levels. An IHS is made of copper. If power density increases significantly copper won't have the capacity to carry heat away from the die quickly enough. In that case, the direct die microchannel/bubble cooling mention in the original article, or something like it, may become a necissity.

The reason an E8400 is easy to cool is because we have not reached this point yet, and it's total power is moderatly low.
Primary
(15 items)
 
Secondary
(13 items)
 
In progress
(10 items)
 
CPUMotherboardGraphicsRAM
5820K @ 4.2/3.5GHz core/uncore, 1.175/1.15v Gigabyte X99 SOC Champion (F22n) Gigabyte AORUS GTX 1080 Ti (F3P) @ 2025/1485, 1... 4x4GiB Crucial @ 2667, 12-12-12-28-T1, 1.34v 
Hard DriveHard DriveHard DriveCooling
Plextor M6e 128GB (fw 1.06) M.2 (PCI-E 2.0 2x) 2x Crucial M4 256GB 4x WD Scorpio Black 500GB Noctua NH-D15 
OSMonitorKeyboardPower
Windows 7 Professional x64 SP1 BenQ BL3200PT Filco Majestouch Tenkeyless (MX Brown) Corsair RM1000x 
CaseMouseAudio
Fractal Design Define R4 Logitech G402 Realtek ALC1150 + M-Audio AV40 
CPUMotherboardGraphicsRAM
X5670 @ 4.4/3.2GHz core/uncore, 1.36 vcore, 1.2... Gigabyte X58A-UD5 r2.0 w/FF3mod10 BIOS Sapphire Fury Nitro OC+ @ 1053/500, 1.225vGPU/1... 2x Samsung MV-3V4G3D/US @ 2000, 10-11-11-30-T1,... 
RAMHard DriveHard DriveHard Drive
1x Crucial BLT4G3D1608ET3LX0 @ 2000, 10-11-11-3... OCZ (Toshiba) Trion 150 120GB Hyundai Sapphire 120GB 3x Hitachi Deskstar 7k1000.C 1TB 
CoolingOSPowerCase
Noctua NH-D14 Windows 7 Pro x64 SP1 Antec TP-750 Fractal Design R5 
Audio
ASUS Xonar DS 
CPUMotherboardGraphicsRAM
i7-6800K @ 4.3/3.5GHz core/uncore, 1.36/1.2v ASRock X99 OC Formula (P3.10) GTX 780 (temporary) 4x4GiB Crucial DDR4-2400 @ 11-13-12-28-T2, 1.33v 
Hard DriveHard DriveCoolingOS
Intel 600p 256GB NVMe 2x HGST Travelstar 7k1000 1TB Corsair H55 (temporary) Windows Server 2016 Datacenter 
PowerCase
Seasonic SS-860XP2 Corsair Carbide Air 540 
  hide details  
Reply
Primary
(15 items)
 
Secondary
(13 items)
 
In progress
(10 items)
 
CPUMotherboardGraphicsRAM
5820K @ 4.2/3.5GHz core/uncore, 1.175/1.15v Gigabyte X99 SOC Champion (F22n) Gigabyte AORUS GTX 1080 Ti (F3P) @ 2025/1485, 1... 4x4GiB Crucial @ 2667, 12-12-12-28-T1, 1.34v 
Hard DriveHard DriveHard DriveCooling
Plextor M6e 128GB (fw 1.06) M.2 (PCI-E 2.0 2x) 2x Crucial M4 256GB 4x WD Scorpio Black 500GB Noctua NH-D15 
OSMonitorKeyboardPower
Windows 7 Professional x64 SP1 BenQ BL3200PT Filco Majestouch Tenkeyless (MX Brown) Corsair RM1000x 
CaseMouseAudio
Fractal Design Define R4 Logitech G402 Realtek ALC1150 + M-Audio AV40 
CPUMotherboardGraphicsRAM
X5670 @ 4.4/3.2GHz core/uncore, 1.36 vcore, 1.2... Gigabyte X58A-UD5 r2.0 w/FF3mod10 BIOS Sapphire Fury Nitro OC+ @ 1053/500, 1.225vGPU/1... 2x Samsung MV-3V4G3D/US @ 2000, 10-11-11-30-T1,... 
RAMHard DriveHard DriveHard Drive
1x Crucial BLT4G3D1608ET3LX0 @ 2000, 10-11-11-3... OCZ (Toshiba) Trion 150 120GB Hyundai Sapphire 120GB 3x Hitachi Deskstar 7k1000.C 1TB 
CoolingOSPowerCase
Noctua NH-D14 Windows 7 Pro x64 SP1 Antec TP-750 Fractal Design R5 
Audio
ASUS Xonar DS 
CPUMotherboardGraphicsRAM
i7-6800K @ 4.3/3.5GHz core/uncore, 1.36/1.2v ASRock X99 OC Formula (P3.10) GTX 780 (temporary) 4x4GiB Crucial DDR4-2400 @ 11-13-12-28-T2, 1.33v 
Hard DriveHard DriveCoolingOS
Intel 600p 256GB NVMe 2x HGST Travelstar 7k1000 1TB Corsair H55 (temporary) Windows Server 2016 Datacenter 
PowerCase
Seasonic SS-860XP2 Corsair Carbide Air 540 
  hide details  
Reply
post #26 of 33
Quote:
Originally Posted by Blameless View Post
A P3-500 celeron disipates quite a bit less heat than an E8400, even as efficent as the latter chip is. So, heat density has increased, along with transistor density. Stating their dies are of similar size is true, and this is precisely what proves my point. A 500MHz P3 celeron is a ~25w chip. An E8400 is 65w.

Right now, copper has low enough thermal resistance and high enough thermal conductivity to work with current transistor/heat densisity levels. An IHS is made of copper. If power density increases significantly copper won't have the capacity to carry heat away from the die quickly enough. In that case, the direct die microchannel/bubble cooling mention in the original article, or something like it, may become a necissity.

The reason an E8400 is easy to cool is because we have not reached this point yet, and it's total power is moderatly low.
I mentioned the die sizes were roughly the same between the p3-500 celeron and the e8400, not the temps.

I agree it has gone up slightly. But if we use these 2 chips as a basis, it took 11-12 years to go up by about 2.5x on TDP. Assuming TDP increase over years was linear this would mean around another 20 years or so to hit 300w, assuming CPU architecture continues the same way.

20 years....nowhere even close to 3 years.

However, if we factor in the GPU being integrated into new chips, this does change things.
Foldatron
(17 items)
 
Mat
(10 items)
 
Work iMac
(9 items)
 
CPUMotherboardGraphicsGraphics
i7 950 EVGA x58 3-way SLI EVGA GTX 660ti GTX 275 
RAMHard DriveHard DriveHard Drive
3x2GB Corsair Dominator DDR3-1600 80GB Intel X25-M SSD 2TB WD Black 150GB WD Raptor 
Hard DriveOSMonitorKeyboard
2x 150GB WD V-raptor in RAID0 Win7 Home 64-bit OEM 55" LED 120hz 1080p Vizio MS Natural Ergonomic Keyboard 4000 
PowerCase
750W PC P&C Silencer CoolerMaster 690 
CPUGraphicsRAMHard Drive
Intel Core i5 2500S AMD 6770M 8GB (2x4GB) at 1333Mhz 1TB, 7200 rpm 
Optical DriveOSMonitorKeyboard
LG 8X Dual-Layer "SuperDrive" OS X Lion 27" iMac screen Mac wireless keyboard 
Mouse
Mac wireless mouse 
CPUGraphicsRAMHard Drive
i7-2600K AMD 6970M 1GB 16GB PC3-10600 DDR3 1TB 7200rpm 
Hard DriveOptical DriveOSMonitor
256GB SSD 8x DL "SuperDrive" OS X 10.7 Lion 27" 2560x1440 iMac display 
Monitor
27" Apple thunderbolt display 
  hide details  
Reply
Foldatron
(17 items)
 
Mat
(10 items)
 
Work iMac
(9 items)
 
CPUMotherboardGraphicsGraphics
i7 950 EVGA x58 3-way SLI EVGA GTX 660ti GTX 275 
RAMHard DriveHard DriveHard Drive
3x2GB Corsair Dominator DDR3-1600 80GB Intel X25-M SSD 2TB WD Black 150GB WD Raptor 
Hard DriveOSMonitorKeyboard
2x 150GB WD V-raptor in RAID0 Win7 Home 64-bit OEM 55" LED 120hz 1080p Vizio MS Natural Ergonomic Keyboard 4000 
PowerCase
750W PC P&C Silencer CoolerMaster 690 
CPUGraphicsRAMHard Drive
Intel Core i5 2500S AMD 6770M 8GB (2x4GB) at 1333Mhz 1TB, 7200 rpm 
Optical DriveOSMonitorKeyboard
LG 8X Dual-Layer "SuperDrive" OS X Lion 27" iMac screen Mac wireless keyboard 
Mouse
Mac wireless mouse 
CPUGraphicsRAMHard Drive
i7-2600K AMD 6970M 1GB 16GB PC3-10600 DDR3 1TB 7200rpm 
Hard DriveOptical DriveOSMonitor
256GB SSD 8x DL "SuperDrive" OS X 10.7 Lion 27" 2560x1440 iMac display 
Monitor
27" Apple thunderbolt display 
  hide details  
Reply
post #27 of 33
Yeah just like they said the future's computers would take up several stories of buildings and only the three richest people in the world could afford one?

I think we already see a trend to cooler running faster chips. But yeah if they can come up with a better liquid cooling system, more power to them.
Mira
(17 items)
 
R a z a N e u n
(15 items)
 
 
CPUMotherboardGraphicsRAM
Intel Core i5 2400S ASRock Z77 Extreme 4 AMD Radeon R9 390 Crucial Ballistix Tracer 
Hard DriveHard DriveOptical DriveCooling
Samsung SSD 850 Pro 256GB Western Digital WD50000LPLX LG BR/DVD/CD Burner Air Nation 
OSMonitorMonitorMonitor
Windows 10 Home RCA 32" 1080p RCA 32" 1080p LG 32" 1080p 
KeyboardPowerCaseMouse
Cooler Master Devastator II Ultra 1000w PC Voodoo Rage Cooler Master Devastator II 
Mouse Pad
Custom 
CPUMotherboardGraphicsRAM
Intel Core 2 Quad Q8400 EP45-UD3L ATI Radeon HD 6950 Crucial Ballistix Tracer 
Hard DriveOptical DriveCoolingOS
1TB Western Digital LiteON DVD+-RW ArcticCooling CPU | 4x 80mm Case Fans Windows 7 Ultimate (64bit) 
MonitorKeyboardPowerCase
Sony 46" + LG 32" Logitech G15 Silverstone ST60F 600W VoodooPC Rage D:100 
MouseMouse PadAudio
Logitech VX Revolution Vera Wang AltecLansing 5.1 300W Surround 
  hide details  
Reply
Mira
(17 items)
 
R a z a N e u n
(15 items)
 
 
CPUMotherboardGraphicsRAM
Intel Core i5 2400S ASRock Z77 Extreme 4 AMD Radeon R9 390 Crucial Ballistix Tracer 
Hard DriveHard DriveOptical DriveCooling
Samsung SSD 850 Pro 256GB Western Digital WD50000LPLX LG BR/DVD/CD Burner Air Nation 
OSMonitorMonitorMonitor
Windows 10 Home RCA 32" 1080p RCA 32" 1080p LG 32" 1080p 
KeyboardPowerCaseMouse
Cooler Master Devastator II Ultra 1000w PC Voodoo Rage Cooler Master Devastator II 
Mouse Pad
Custom 
CPUMotherboardGraphicsRAM
Intel Core 2 Quad Q8400 EP45-UD3L ATI Radeon HD 6950 Crucial Ballistix Tracer 
Hard DriveOptical DriveCoolingOS
1TB Western Digital LiteON DVD+-RW ArcticCooling CPU | 4x 80mm Case Fans Windows 7 Ultimate (64bit) 
MonitorKeyboardPowerCase
Sony 46" + LG 32" Logitech G15 Silverstone ST60F 600W VoodooPC Rage D:100 
MouseMouse PadAudio
Logitech VX Revolution Vera Wang AltecLansing 5.1 300W Surround 
  hide details  
Reply
post #28 of 33
Quote:
Originally Posted by Blameless View Post

Right now, copper has low enough thermal resistance and high enough thermal conductivity to work with current transistor/heat densisity levels. An IHS is made of copper. If power density increases significantly copper won't have the capacity to carry heat away from the die quickly enough. In that case, the direct die microchannel/bubble cooling mention in the original article, or something like it, may become a necissity.
I'd just like to quote you so that others actually read this, as this is the important information. It's not TDP, it's heat/area. A 65W 45nm chip outputs more heat/area compared to a 65nm 65W chip(assuming they consume the same amount of power, and are of course the same architecture). Eventually the size of the die will be too small for copper alone to effectively remove heat.
mitx
(16 items)
 
  
CPUMotherboardGraphicsRAM
Intel i5 3570K 4.5ghz ASRock Z77E-ITX Sapphire R9 290x Tri-X 1200/1500 Crucial Ballistix Tactical LP 2x8 GB 8-8-8-24-1T 
Hard DriveHard DriveHard DriveHard Drive
Samsung 840 Pro 256gb Western Digital Velociraptor Western Digital WD15EARX Western Digital WD15EADS 
CoolingOSMonitorKeyboard
Silverstone NT06-Pro Windows 10 x64 LG 29UM67 Logitech G710+ 
PowerCaseMouseAudio
Silverstone SG08 600W PSU Silverstone SG08B Logitech G700 Pioneer SE-A1000 
  hide details  
Reply
mitx
(16 items)
 
  
CPUMotherboardGraphicsRAM
Intel i5 3570K 4.5ghz ASRock Z77E-ITX Sapphire R9 290x Tri-X 1200/1500 Crucial Ballistix Tactical LP 2x8 GB 8-8-8-24-1T 
Hard DriveHard DriveHard DriveHard Drive
Samsung 840 Pro 256gb Western Digital Velociraptor Western Digital WD15EARX Western Digital WD15EADS 
CoolingOSMonitorKeyboard
Silverstone NT06-Pro Windows 10 x64 LG 29UM67 Logitech G710+ 
PowerCaseMouseAudio
Silverstone SG08 600W PSU Silverstone SG08B Logitech G700 Pioneer SE-A1000 
  hide details  
Reply
post #29 of 33
Quote:
Originally Posted by ryboto View Post
I'd just like to quote you so that others actually read this, as this is the important information. It's not TDP, it's heat/area. A 65W 45nm chip outputs more heat/area compared to a 65nm 65W chip(assuming they consume the same amount of power, and are of course the same architecture). Eventually the size of the die will be too small for copper alone to effectively remove heat.
*sigh*.......Yes, but as the process shrinks, so does the voltage, and the amount of power, and therefore the amount of heat over any given area also decreases. This is why my 4 year old AMD AthlonXP was much slower, less cores, and still had 30W higher TDP than my current e8400.
Foldatron
(17 items)
 
Mat
(10 items)
 
Work iMac
(9 items)
 
CPUMotherboardGraphicsGraphics
i7 950 EVGA x58 3-way SLI EVGA GTX 660ti GTX 275 
RAMHard DriveHard DriveHard Drive
3x2GB Corsair Dominator DDR3-1600 80GB Intel X25-M SSD 2TB WD Black 150GB WD Raptor 
Hard DriveOSMonitorKeyboard
2x 150GB WD V-raptor in RAID0 Win7 Home 64-bit OEM 55" LED 120hz 1080p Vizio MS Natural Ergonomic Keyboard 4000 
PowerCase
750W PC P&C Silencer CoolerMaster 690 
CPUGraphicsRAMHard Drive
Intel Core i5 2500S AMD 6770M 8GB (2x4GB) at 1333Mhz 1TB, 7200 rpm 
Optical DriveOSMonitorKeyboard
LG 8X Dual-Layer "SuperDrive" OS X Lion 27" iMac screen Mac wireless keyboard 
Mouse
Mac wireless mouse 
CPUGraphicsRAMHard Drive
i7-2600K AMD 6970M 1GB 16GB PC3-10600 DDR3 1TB 7200rpm 
Hard DriveOptical DriveOSMonitor
256GB SSD 8x DL "SuperDrive" OS X 10.7 Lion 27" 2560x1440 iMac display 
Monitor
27" Apple thunderbolt display 
  hide details  
Reply
Foldatron
(17 items)
 
Mat
(10 items)
 
Work iMac
(9 items)
 
CPUMotherboardGraphicsGraphics
i7 950 EVGA x58 3-way SLI EVGA GTX 660ti GTX 275 
RAMHard DriveHard DriveHard Drive
3x2GB Corsair Dominator DDR3-1600 80GB Intel X25-M SSD 2TB WD Black 150GB WD Raptor 
Hard DriveOSMonitorKeyboard
2x 150GB WD V-raptor in RAID0 Win7 Home 64-bit OEM 55" LED 120hz 1080p Vizio MS Natural Ergonomic Keyboard 4000 
PowerCase
750W PC P&C Silencer CoolerMaster 690 
CPUGraphicsRAMHard Drive
Intel Core i5 2500S AMD 6770M 8GB (2x4GB) at 1333Mhz 1TB, 7200 rpm 
Optical DriveOSMonitorKeyboard
LG 8X Dual-Layer "SuperDrive" OS X Lion 27" iMac screen Mac wireless keyboard 
Mouse
Mac wireless mouse 
CPUGraphicsRAMHard Drive
i7-2600K AMD 6970M 1GB 16GB PC3-10600 DDR3 1TB 7200rpm 
Hard DriveOptical DriveOSMonitor
256GB SSD 8x DL "SuperDrive" OS X 10.7 Lion 27" 2560x1440 iMac display 
Monitor
27" Apple thunderbolt display 
  hide details  
Reply
post #30 of 33
Quote:
Originally Posted by lordikon View Post
*sigh*.......Yes, but as the process shrinks, so does the voltage, and the amount of power, and therefore the amount of heat over any given area also decreases. This is why my 4 year old AMD AthlonXP was much slower, less cores, and still had 30W higher TDP than my current e8400.
You miss the point. With multicore, the only way TDP is going is up. Yes for a single core it will drop, SLOWLY with smaller fabrication processes, but with multiple cores it can double in a single leap of processor generation (Eg. Core 2 Duo -> Core 2 Quad)

Whilst at first glance it would appear things can only get cooler, multiple cores means things are only going to get hotter under the collar for CPU manufacturers.
    
CPUMotherboardGraphicsRAM
Intel Centrino T2300 @ 1.83 GHz Intel GM945 Express Chipset Intel GMA950 2x1GB PC2-5300 667MHz 
Hard DriveOptical DriveOSMonitor
250GB 7200rpm WD Scorpio Black USB External DVD/CDRW Windows XP Pro SP3 12.1" 1024x768 DVI 
PowerCaseMouse
4400mAh Li-ion (7+ hours on power saving profile) Carbon Fibre with Magnesium alloy roll cage IBM Trackpoint 
  hide details  
Reply
    
CPUMotherboardGraphicsRAM
Intel Centrino T2300 @ 1.83 GHz Intel GM945 Express Chipset Intel GMA950 2x1GB PC2-5300 667MHz 
Hard DriveOptical DriveOSMonitor
250GB 7200rpm WD Scorpio Black USB External DVD/CDRW Windows XP Pro SP3 12.1" 1024x768 DVI 
PowerCaseMouse
4400mAh Li-ion (7+ hours on power saving profile) Carbon Fibre with Magnesium alloy roll cage IBM Trackpoint 
  hide details  
Reply
New Posts  All Forums:Forum Nav:
  Return Home
  Back to Forum: Hardware News
Overclock.net › Forums › Industry News › Hardware News › [Science Blog] Tiny bubbles key to future liquid-cooling