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Intel prepares to cut manufacturing costs with 450mm wafers

Intel Corporation, Samsung Electronics and TSMC today announced they have reached agreement on the need for industry-wide collaboration to target a transition to larger, 450mm-sized wafers starting in 2012. The transition to larger wafers will enable continued growth of the semiconductor industry and helps maintain a reasonable cost structure for future integrated circuit manufacturing and applications.

The companies will cooperate with the semiconductor industry to help ensure that all of the required components, infrastructure and capability are developed and tested for a pilot line by this target date.

Historically, manufacturing with larger wafers helps increase the ability to produce semiconductors at a lower cost. The total silicon surface area of a 450mm wafer and the number of printed die (individual computer chips, for example) is more than twice that of a 300mm wafer. The bigger wafers help lower the production cost per chip. Additionally, through more efficient use of energy, water and other resources, bigger wafers can help diminish overall use of resources per chip. For example, the conversion from 200mm wafers to 300mm wafers helped reduce aggregate emissions per chip of air pollution, global warming gasses and water, and further reduction is expected with a transition to 450mm wafers.
    
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CPUMotherboardGraphicsRAM
Intel Core i7-2600K ASUS P8P67 EVO NVIDIA GeForce GTX 580 SLI 16GB OCZ Triple-Channel 1600MHz DDR3 CL6 
Hard DriveOptical DriveOSMonitor
256GB OCZ Vertex Pro SSD ASUS Blu-Ray Disc Burner Windows 7 Ultimate 64-bit 26" LCD 1920x1200 
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