The passage to the use of silicic plates with larger diameter allows to increase the production volumes and reduce its prime cost. But the problem here that each new step with the increase in plates diameter requires high expenditures for production rearmament and scientific research . Intel company began to use 300 mm plate several years ago, but AMD does not hurry to pass on 450 mm plate.
Yesterday intel company reported that they concluded agreement about collaboration with Samsung and TSMC, which will allow to divide between the companies risks and expenditures, connected with the preparation for passage on 300 mm to 450 mm silicic plates. It is expected that passage to use the new plates will start in 2012.
As a result of increase in the diameter of silicic plate from 300 to 450 mm will increase the quantity of processors, obtained from one layer more than twice. The prime cost of production will be lowered and energy resources will be reduced . According to experts evaluations , overpower passage on 450 mm plate is useful for companies, which possess the annual turnover not less than $10 billion .
In the past (ten years ago) a 1.5-time increase in the diameters of silicic plates was required: if 200 mm plate was released in 1991, then 300 mm plate appeared in 2001.