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Shin-Etsu X23-7762 application technique?

post #1 of 6
Thread Starter 
I just received my syringe of Shin-Etsu thermal compound, been using AS5. Does anyone know the manufacturer's recommended way to apply it on a quad core? I was just going to try the thin line method first.
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post #2 of 6
Thread Starter 
Bump?
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post #3 of 6
I just put a dab on the center and put my heatsink on...but any way I do it I fail miserably...

~Gooda~
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post #4 of 6
Thread Starter 
Thanks, I'll probably try that if the line doesn't work well. I don't feel like messing with it tonight, so I'll probably apply it tomorrow sometime.
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post #5 of 6
I've found that the best method for most thermal compounds (so long as they aren't incredibly viscous) is a combination of the spread method and thin line method....

First, put a very small dab at the center... spread this around using your finger in an inside-out plastic bag (take care to have your finger very tight against the plastic bag... this is to prevent aren't any creases in the plastic bag which could cause uneven distribution/tiny air pockets)... you want to have a fairly thin layer - if it doesn't seem thin enough, wipe off the excess TIM from your finger/plastic bag with a cloth and alcohol then respread (this will lift off some of the TIM, thinning the layer)

After you have this nice layer, apply the thin line down the center (parallel the notch for quads - perpendicular for dual cores)then simply attach your HSF...If both surfaces are flat, the spread layer will ensure full surface contact while the line ensures no air bubbles and good contact at the main heat source on the IHS

I've used a variety of methods and this seems to work the best - Proof below

Stock lapped Q6600 w/ lapped Tuniq
Edited by killa_concept - 5/15/08 at 9:14pm
post #6 of 6
Quote:
Originally Posted by killa_concept View Post
I've found that the best method for most thermal compounds (so long as they aren't incredibly viscous) is a combination of the spread method and thin line method....

First, put a very small dab at the center... spread this around using your finger in an inside out plastic bag (take care to have your finger very tight against the plastic bag... this is to prevent aren't any creases in the plastic bag which could cause uneven distribution/tiny air pockets)... you want to have a fairly thin layer - if it doesn't seem thin enough, wipe off the excess TIM from your finger/plastic bag with a cloth and alcohol then respread (this will lift off some of the TIM, thinning the layer)

After you have this nice layer, apply the thin line down the center (parallel the notch for quads - perpendicular for dual cores)then simply attach your HSF....

If both surfaces are flat, the spread layer will ensure full surface contact while the line ensures no air bubbles and good contact at the main heat spot
This has worked great for me with p4's and d's but not with the c2's.

With the shin-etsu, I've found a small dot in the center to work real well, especially with two lapped surfaces.

EDIT: Just an additional two cents-> shin-etsu has provided the best consistency between cores for me.
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