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Alternitave to lapping - Page 3

post #21 of 25
Quote:
Originally Posted by Silviastud View Post
rofl
Here's Urban Dictionary on muffing, figured it had something to do with "muff"
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post #22 of 25
Thread Starter 
Quote:
Originally Posted by EmerilLIVE View Post
Here's Urban Dictionary on muffing, figured it had something to do with "muff"
LOL

I defiantly misheard him then.
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post #23 of 25
Quote:
Originally Posted by dthmtlhed View Post
Another thing to think about is that he'd probably have to use a buffing wheel which would, well, be quite an experience trying to use on something as small as a processor (although they might make smaller version then what I've seen).
Can you imagine the look on his face if he lost the grip on his chip while using a buffing wheel.
    
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post #24 of 25
Well, it's already been said but I might as well add to it...

The purpose of lapping is to get a FLAT surface, not a shiny one.... considering that thermal compounds are always used, there will always be material between the IHS and HSF... this basically nullifies any difference in temps between surfaces lapped to 800 and those lapped to 2000...

Buffing would only make the surface more shiny... again, no temperature difference between 800grit and buffed to mirror finish (providing that the surface has been lapped FLAT and thermal compound is used)

Lastly, buffing generally makes use of abrasives and high speed mopping w/ cloth like materials.... the former has the chance of adding unwanted chemicals to your surfaces and the latter would equate to magnetization or static (scary with a HSF, deadly w/ a $200+ CPU)

Stick with good old lapping
You'll see no positives from buffing and will most likely be met with disastrous results
Edited by killa_concept - 5/20/08 at 8:52pm
post #25 of 25
Thread Starter 
Quote:
Originally Posted by killa_concept View Post
Well, it's already been said but I might as well add to it...

The purpose of lapping is to get a FLAT surface, not a shiny one.... considering that thermal compounds are always used, there will always be material between the IHS and HSF... this basically nullifies any difference in temps between surfaces lapped to 800 and those lapped to 2000...

Buffing would only make the surface more shiny... again, no temperature difference between 800grit and buffed to mirror finish (providing that the surface has been lapped FLAT and thermal compound is used)

Lastly, buffing generally makes use of abrasives and high speed mopping w/ cloth like materials.... the former has the chance of adding unwanted chemicals to your surfaces and the latter would equate to magnetization or static (scary with a HSF, deadly w/ a $200+ CPU)

Stick with good old lapping
You'll see no positives from buffing and will most likely be met with disastrous results
Allright, thanks for the input and a great post. I'll probably get a few pieces of sandpaper off him and do it the hard way.

Then I'll buff the stock heatsink and see what happens.
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