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[DvHW] ThermalRight HSC-101 - new case for passive cooling - Page 3

post #21 of 46
gzuz 8 christ!!
post #22 of 46
Quote:
Originally Posted by stargate125645 View Post
You've never touched your heated chipset heat pipes, I take it?
I've taken heatpipes and held a lighter to them. Also, I understand how heatpipes work via reading up on white papers.
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post #23 of 46
Quote:
Originally Posted by DuckieHo View Post
I've taken heatpipes and held a lighter to them. Also, I understand how heatpipes work via reading up on white papers.
Aside from the fact that holding a lighter to a heat pipe is not the same thing, it doesn't matter what you've read; chipset heat pipes can be hot for the full length. If you meant to say that the ends of the ends of the heat pipes can be hotter, then I would be more inclined to agree since part of the innards of a heat pipe can be exposed on some models, such as with the Tuniq Tower 120. But your original statement was blanketed.
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post #24 of 46
Quote:
Originally Posted by stargate125645 View Post
Aside from the fact that holding a lighter to a heat pipe is not the same thing, it doesn't matter what you've read; chipset heat pipes can be hot for the full length. If you meant to say that the ends of the ends of the heat pipes can be hotter, then I would be more inclined to agree since part of the innards of a heat pipe can be exposed on some models, such as with the Tuniq Tower 120. But your original statement was blanketed.
I'd have to agree with you more myself, I've currently got my laptop opened up and running, it has a single heat pipe running from the CPU to the GPU and then to the fins and fan. Every part of that heat pipe is very very warm, granted it's a laptop, but the same is true for the heat pipes on my Maximus Formula motherboard and the ones in my AC Accelero Extreme GPU cooler.

I've never had a heat pipe be noticably warmer at the ends and that'd actually make less sense as the liquid would condense on the coolest parts, which should surely be furthest away from the heat source (inside the fins away from the CPU/GPU etc).

Back on topic, I think the Zalman TNN cases could do so much better if they had some decent fans, the idea is solid, but you'll always get such better cooling performance by having a fan or two to keep the air moving. Even with the ultimate water cooling system, with no airflow at all, it'll just warm up gradually until the case is an oven. I'm hoping that Thermalright aren't going for extreme silence but extreme cooling, so they'l include some fans. Not that I think the case will be in my price range anyway... But it'd be nice to see more cases using this sort of approach to help make it more mainstream accessible.
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post #25 of 46
If you OC your processor, you have to put a ton of ramsinks all over the outside of the case!
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post #26 of 46
Quote:
Originally Posted by joemaniaci View Post
If you OC your processor, you have to put a ton of ramsinks all over the outside of the case!
Hey, at least you have plenty of surface area to stick said ramsinks to.

It depends what this thing looks like on the inside, if it has fins galore and a load of fans, I think it'll do well, but if it's taking the Zalman approach... Nah, TNN is not for enthusiasts.
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post #27 of 46
Looks interesting. Of course we need some piccies to see how this thing turns.
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post #28 of 46
I just dont get how the cpu gets whatever it is attached to it, its not like copper is that flexible.

The only thing I can think of is that the cpu cooler just sits in its position at all times and you have a mobo tray that you install that doesnt slide in the back, but comes in through the far side of the case.
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post #29 of 46
Quote:
Originally Posted by stargate125645 View Post
Aside from the fact that holding a lighter to a heat pipe is not the same thing, it doesn't matter what you've read; chipset heat pipes can be hot for the full length. If you meant to say that the ends of the ends of the heat pipes can be hotter, then I would be more inclined to agree since part of the innards of a heat pipe can be exposed on some models, such as with the Tuniq Tower 120. But your original statement was blanketed.
I can guarantee you that the walls of the heatpipe are cooler that of the working fluid. Why? If the walls were the temperature of or greater than the working fluid, the wicked fluid would vaporize and the phase change effect of the heatpipe would breakdown. Virtually all heatpipes in PC usage use a sinter powder coating for wicking. Holding lighter to a heatpipe IS like using a heatpipe on chipset. Breaking it down to heatpipe modelling... energy in, energy out.

I will make a correction though:
The walls of the heat pipes are much cooler than the internals. Like 99% of the heat transferred is within the working fluid.

Better?

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post #30 of 46
Quote:
Originally Posted by DuckieHo View Post
I can guarantee you that the walls of the heatpipe are cooler that of the working fluid. Why? If the walls were the temperature of or greater than the working fluid, the wicked fluid would vaporize and the phase change effect of the heatpipe would breakdown. Virtually all heatpipes in PC usage use a sinter powder coating for wicking. Holding lighter to a heatpipe IS like using a heatpipe on chipset. Breaking it down to heatpipe modelling... energy in, energy out.

I will make a correction though:
The walls of the heat pipes are much cooler than the internals. Like 99% of the heat transferred is within the working fluid.

Better?

It's not my fault you said something entirely different the first time around. I never said the innards of the heat pipe were cooler; in fact, I said the opposit explicitly in a previous post so I don't know why you bother to post so much when all that was necessary was the correction.
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