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[BBC] IBM aims to cool chips with water

post #1 of 6
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Quote:
Laying chips vertically, instead of side by side, reduces the distance data has to travel , enhancing performance and saving critical space.

Each 4 sq cm sandwich is just 1mm thick but pumps out close to 1kilowatt - 10 times that generated by a hotplate.

Conventional cooling techniques such as fans and heat sinks do not work as well with the 3D technology, particularly as heat has to be drawn away from between the individual chips.

To get around this, researchers piped water through sealed tubes just 50 microns (millionths of a metre) in diameter, between individual layers.
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post #2 of 6
damn... look's like we're going to have to fork out the dough for water cooling systems...
lol
I wonder if they include an entire WC system? But a 1kw cpu? Isn't that a little bit... much?
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post #3 of 6
Aren't chips getting cooler as size goes down?
post #4 of 6
Wow, with that much heat you could build a steam engine.
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post #5 of 6
Quote:
Originally Posted by rduffy123 View Post
Aren't chips getting cooler as size goes down?
Yes and no. The overall chip yes. But your packing more transistors in a smaller space resulting in a hotter per cm².
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post #6 of 6
Quote:
Originally Posted by nategr8ns View Post
damn... look's like we're going to have to fork out the dough for water cooling systems...
lol
I wonder if they include an entire WC system? But a 1kw cpu? Isn't that a little bit... much?
Not really alot considering the CPU we use now are arounf 100W so 1 KW is 10 times more.
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