I'd be happy running it at 3.6 Ghz. I did some research into OC'ing computers in general, and I came across an article that mentioned that OEM machines aren't that great for OC'ing, in the first place. That they're built with that user-intention out of mind, if that makes any sense. My machine is OEM, I suppose. (It's a CyberPower machine.)
When I was looking at it inside, I noticed that the HSF was sitting on the chip snugly, but that there was A TON of thermal paste between the two. Is that normal? By a ton, I mean like how you'd apply toothpaste to your brush - a substantial glob of it (it was almost overflowing). I touched it, and it was still malleable - isn't it supposed to harden?
Reading the Artic 5 Thermal Paste manual, aren't you only supposed to have one thin line of thermal paste down the middle of the CPU?
Do you think that, perhaps, the thermal paste impeding the heat transfer to the HSF?