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PERC 5/i RAID Card: Tips and Benchmarks - Page 372

post #3711 of 7150
Quote:
Originally Posted by ShadowFox19 View Post
1.) I'm looking to add another drive to my RAID 5 on my PERC 6 card, and I was wondering if I can do so without losing anything that's on the VD in Windows right now.
I added another drive to a 3 drive R5, and managed to keep the VD (and data).

Quote:
Originally Posted by ShadowFox19 View Post
Dangit! That means I'm going to have to buy a 2TB external drive.
I'm not sure on your situation, but you could consider making a new array (make sure it's GPT )with the disks you are going to add, then copy over your data, then add the disks from your old array.
post #3712 of 7150
Quote:
Originally Posted by ShadowFox19 View Post
Dangit! That means I'm going to have to buy a 2TB external drive.
Maybe not. When I installed Windows on a clean drive, it automatically made it GPT. You can look at the properties of e.g. "Disk 0" in Disk Management to see if it's already GPT or not.
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post #3713 of 7150
Quote:
Since SAS is downwards compatible with SATA, you just need the correct cable. A SAS SFF-8484 to 4xSATA cable runs for $10. Make sure to get pass-through. Do not get crossover or backplane cables
http://cgi.ebay.com/SAS-32-Pin-to-4X...item3a5434df46 <<< this will work ? If not, can anybody send me a correct ebay link with cheap cables ?

EDIT: http://cgi.ebay.com/New-32-Pin-SFF-8...item439b948456 <<< and this one?
Edited by LuciferX - 12/19/09 at 1:41pm
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post #3714 of 7150
Quote:
Originally Posted by LuciferX View Post
http://cgi.ebay.com/SAS-32-Pin-to-4X...item3a5434df46 <<< this will work ? If not, can anybody send me a correct ebay link with cheap cables ?

EDIT: http://cgi.ebay.com/New-32-Pin-SFF-8...item439b948456 <<< and this one?
Yes, both of those are correct.
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post #3715 of 7150
any point in cooling the mem? i was thinking of buying a Thermaltake SPIRIT RS for it
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post #3716 of 7150
Quote:
Originally Posted by iakovl View Post
any point in cooling the mem? i was thinking of buying a Thermaltake SPIRIT RS for it
On the PERC 5/i ECC Registered RAM gets very hot, so it needs to be cooled.
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post #3717 of 7150
Quote:
Originally Posted by Tator Tot View Post
On the PERC 5/i ECC Registered RAM gets very hot, so it needs to be cooled.
I don't have a PERC 5, but in my experience cooling RAM with extra heatsinks has never really been necessary. Airflow over the DIMM is a must though. In fact I have heard (and seen reviews) that many aftermarket heatsinks for RAM often end up with some or all of the chips suffering higher temps than when run bare.

If you do add an aftermarket heatsink take extra care to ensure that ALL the memory chips are properly connected to the heatsink. If you don't you will cook that chip, destroying the whole DIMM. It may be quite difficult to ensure all the chips are in tight contact with the sink, and even the tiniest gap will dramatically lower the heat transferred.
post #3718 of 7150
Thread Starter 
Quote:
Originally Posted by the_beast View Post
I don't have a PERC 5, but in my experience cooling RAM with extra heatsinks has never really been necessary. Airflow over the DIMM is a must though. In fact I have heard (and seen reviews) that many aftermarket heatsinks for RAM often end up with some or all of the chips suffering higher temps than when run bare.
Another reason to use heatspreaders it to help distribute the heat on the ICs to reduce thermal wear on the solder balls.



http://www.bit-tech.net/hardware/mem...emory_part_2/4
Quote:
BGA-PCB Joints Stress

On the other hand, shorter connectors arranged in a grid fashion at the bottom of the chip can result in non-uniform stress between each pin or solder ball during thermal expansion and contraction cycles. This happens when the DRAM heats up and expands at a different rate relative to the attached Printed Circuit Board (PCB).

The different rate of expansion between the PCB and the DRAM chip stresses the soldered balls and can result in fractured connections - this is one of the reasons why users should not increase the DRAM voltage higher than the specification, unless there is extra effort applied to keeping the memory cool. Higher voltage will generate more heat and degrade the internal DRAM circuitries at a faster rate.
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post #3719 of 7150
Quote:
Originally Posted by DuckieHo View Post
Another reason to use heatspreaders it to help distribute the heat on the ICs to reduce thermal wear on the solder balls.
I'm not sure how that is supposed to help - it doesn't matter how uniformly the chip heats up, it will always expand and contract at a different rate to the pcb, as they are made of different materials. The only thing you can do to reduce the problem is either reduce the temperature the RAM reaches (by using good cooling - which many aftermarket kits do not provide), or by more closely matching the temperature properties of the 2 materials soldered together.
post #3720 of 7150
Thread Starter 
Quote:
Originally Posted by the_beast View Post
I'm not sure how that is supposed to help - it doesn't matter how uniformly the chip heats up, it will always expand and contract at a different rate to the pcb, as they are made of different materials. The only thing you can do to reduce the problem is either reduce the temperature the RAM reaches (by using good cooling - which many aftermarket kits do not provide), or by more closely matching the temperature properties of the 2 materials soldered together.
i.e. One corner of the IC is hotter than the rest of the chip. Therefore, this section of the chip has expanded more than the rest of the chip.... so more localized stress due to the thermal difference. A heatspreader would reduce the thermal differential.
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