The OCZ Technology Group is already preparing for the holidays but that doesn't mean it paused work on new, high-performance memory so now, it has announced the Flex EX. Featuring both DDR2 and DDR3 memory, the Flex EX series targets enthusiasts and features modules equipped with the new Flex EX XLC (Xtreme Liquid Convention) aluminum heatsink which offers both passive and active cooling options, the latter being enabled by the double liquid cooling channels that go directly over the module's ICs.
"Memory is the primary storage device of any modern computer system and defines how fast the CPU can access data," commented Dr. Michael Schuette, VP of Technology Development at OCZ Technology. "Density, frequency, and access latencies of the system memory are the critical factors for overall performance of any PC and that is where the new OCZ Flex Ex series sets new standards by providing the optimal combination of the three factors for any system architecture by offering unprecedented speed and latencies at 4GB density with advanced cooling options to enhance stability and performance in even the most demanding environments."
For starters, OCZ plans to release four 4GB Flex EX kits - two DDR2 and two DDR3. The DDR2 PC2-6400 kit works at 800 MHz with 4-4-3-15 timings, the PC2-9600 goes at 1200 MHz with 6-6-6-18 timings, the PC3-12800 tops 1600 MHz @ 7-6-6-24 while the PC3-16600 kits reaches 2000 MHz with CL 8-8-8-30. All Flex EX offers are backed by a lifetime warranty.