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[CPC] Intel Integrates TEC into CPU

post #1 of 29
Thread Starter 
A weird one this, I can only find the story in the magazine, not on the website, so no real source link. Hope it's not a repost.

I didn't write it all out as my hands started to hurt

Quote:
Extreme cooling is apparently becoming less extreme and more mainstream every day. Intel has released a paper showing the cooling potential of integrating a TEC into the CPU package...

...a TEC was integrated into a CPU package to reduce the temperature of high heat-flux regions (hotspots) in the CPU. The small TEC sits between the CPU and it's IHS, with a layer of TIM surrounding the sides and underside of the TEC to ensure a consistent level of thermal conductivity...

...Without the TEC, the raw temperature of the hotspots reached 124.5c, but this dropped to 116.9c when the TEC was installed without power. It dropped even further to 109.6c with 3A passing through the TEC...

Researchers have concluded the successful demonstrations of the integrated TEC offers possibilities of an overhaul in the design of high power-density electronic and optoelectronic circuitry...
Source: Custom PC Magazine (any good UK retailer)
Edited by 98uk - 2/18/09 at 9:45am
post #2 of 29
You'll still need a really good cooling system outside the CPU to carry that heat away from the IHS
post #3 of 29
^ Yes, but it would be easier to get the heat to the HSF / Block

So this would be a little TEC between the chip and the IHS. Sounds really interesting actually. What if it fails?
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post #4 of 29
I'd say that's pretty sweet.
post #5 of 29
They've been working on this for years. The tough part was making the TEC small enough so that it could be manufactured right onto the die, unlike the current flavors that are installed on top of the IHS. It would be nice to see a hybrid technology between this and the embedded water cooling IBM is working on. The embedded water cooling brings the heat to the TEC. Now that would be efficient cooling of the CPU.
    
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post #6 of 29
How would they combat condensation within the chip?
    
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post #7 of 29
Quote:
Originally Posted by captthunderpnts View Post
How would they combat condensation within the chip?
If the chip internally was a vacuum, there would be no water vapor to condense.
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post #8 of 29
Even if there wasn't a vacuum inside, such a small TEC would not be able to lower the processor to sub-ambient temperatures
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post #9 of 29
Quote:
Originally Posted by captthunderpnts View Post
How would they combat condensation within the chip?
Direct hit! That is the question. Would it differ much from just having it running on n2o in pot?
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post #10 of 29
Quote:
Originally Posted by Tjingsted View Post
Direct hit! That is the question. Would it differ much from just having it running on n2o in pot?
again, such a small TEC would not reach sub-ambient temperatures.. Just look at the numbers from the article! it dropped the direct temps to 106C. at that temperature, you'd have water vapor, no chance of condensation, forget about forming condensation.
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