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[CPC] Intel Integrates TEC into CPU - Page 3

post #21 of 29
Quote:
Originally Posted by Shadowrunner340 View Post
really? i thought it was heatsink
No, its the heatspreader on every AMD and Intel CPU, why do you think GPUs (No heatspreaders) Look so different from CPUs?
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post #22 of 29
Quote:
Originally Posted by akeedthe View Post
wat does IHS stand for pls?
Quote:
Originally Posted by alex98uk View Post
Integrated Heatshield. The metal top on the CPU
wrong
Quote:
Originally Posted by Shadowrunner340 View Post
really? i thought it was heatsink
wrong
Quote:
Originally Posted by Brutuz View Post
No, its the heatspreader on every AMD and Intel CPU, why do you think GPUs (No heatspreaders) Look so different from CPUs?
CORRRRRRRRRECT!

Integrated Heat Spreader.
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post #23 of 29
Thread Starter 
Spreader

That's what i meant!
post #24 of 29
What's a "TEC"?
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post #25 of 29
Quote:
Originally Posted by Brutuz View Post
No, its the heatspreader on every AMD and Intel CPU, why do you think GPUs (No heatspreaders) Look so different from CPUs?




CPU (no heatspreader)
GPU (no heatspreader)

Looks pretty similar.
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post #26 of 29
I like this idea. Sounds like the way this is setup will simply allow the highest heat generating areas to spread there heat over a larger area and create a more even spread of the heat over the entire IHS. This should help reduce any issues caused by bad contact between the IHS and your specific cooling application. Less chance of a bad connection between the two landing on a hot spot. My question is if this will be cost effective or not and how reliable these TEC's are.
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post #27 of 29
Quote:
Originally Posted by justarealguy View Post
^ Yes, but it would be easier to get the heat to the HSF / Block

So this would be a little TEC between the chip and the IHS. Sounds really interesting actually. What if it fails?

With the TEC off it still gets better temps, dawg. Even if it fails, you still have better temps without it. Failsafe, if you will.
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post #28 of 29
I don't see how it can be possible for the disabled tec to improve temperatures. I won't believe such a thing without much more proof, or a very detailed explanation of how inserting another layer could possibly reduce overall thermal resistance.

Quote:
Originally Posted by Cheetos316 View Post
We won't have to worry about the TIM application since it'll be done before the IHS is put in place. Since the IHS is soldered on with the TEC and CPU die underneath, we wouldn't even get a chance to see the TEC or have the need to apply the TIM. However, that said, they're going to need to find some really good quality TIM, since we can't get to it to replace the TIM.
TIM Intel uses now is better than anything any of us use. It's solder.

Even the non-solder tim they use on there low end chips is decen enough for me to not see any improvement what so ever by replacing it.
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post #29 of 29
Quote:
Originally Posted by switch.dota View Post
What's a "TEC"?
Thermoelectric Cooler
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