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Lapped my Q6600 and Vendetta 2

post #1 of 37
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I had to take my system apart to add a backplate for my Vendetta 2 heatsink so I thought I would take advantage of the opportuity and lap the processor and heatsink. I was in a hurry so I didn't take pictures but the process I followed is listed below.

I used a piece of polished granite as my sanding surface. When we got our granite counter tops for the kitchen they gave us a granite cutting board as a bonus. Never really used it for cutting anything but it is an awesome flat surface for lapping heatsinks

1) Taped some 220 grit to the granite surface and started with the processor. I marked an "X" on the surface with a permanent marker so I could observe where any bumps or valleys appear during sanding. As it turns out the IHS was only slightly raised in the center. It sanded remarkably evenly. I then gave the bottom of the Vendetta 2 a quick lap just to check flatness (I wanted to be careful with the exposed heatpipes... I hear they are thin walled). It looked pretty flat as well although the grind marks were a little rough for my taste. I did notice that the first application of the heatsink seemed to have put small dents into one heatpipe on adjacent corners of the CPU. Never did get those sanded out but they are at the very outside so I wasn't too bothered with them.

2) Changed to 400 grit and repeated on the CPU. Copper looking a little shinier. Again, just a quick lap on the heatsink.

3) Changed to 800 grit. Rinse and repeat....

4) Finished off with 1600 grit. I did not get it to a mirror finish but there were no obvious grooves or scratches at this point. Same with the Vendetta base. Very very smooth but not a mirror.

5) I ran a bead of MX2 along the center of the of aluminum partition between the center heatpipe and the two outside pipes. Smoothed that into the creases so that the TIM on the heatpipes would not ooze up into the crevice and not spread as desired.

6) Using a small plastic flexible tool I then spread a very very thin layer of MX2 along the whole surface of the heatpipes. I have seen other methods that involve one or two dollops on the base and allowing to spread from the center outwards but this seemed like I would guarantee good coverage.

7) Assembled the heatsink on the motherboard and tightened the 4 screws in a diagonal fashion a couple of turns at a time. Very tight fit and excellent compression from what I could see.

And after all of that I reassembled everything in the case and....

No difference from before the lapping

Folding ovenight my Core 0 and Core 1 hit 62C max and Core 2 and 3 hit 57C. This is a Q6600 G0 VID 1.2875 running at 400X9 at 1.44V load (LLC enabled).

So other than the opportunity to gaze upon some smooth copper goodness it seems I may have wasted my time. It may have been that I just had a really flat IHS and heatsink to start with so removing the nickel has minimal impact.

My wife just rolled her eyes when she saw me sanding my new CPU Hard to explain to non-techy types...
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post #2 of 37
Thats good information to know. I was thinking about doing mine pretty soon. I have the same cooler and mine runs a little hotter than yours.
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post #3 of 37
Quote:
Originally Posted by stump1000 View Post
Thats good information to know. I was thinking about doing mine pretty soon. I have the same cooler and mine runs a little hotter than yours.
Get the bolt through kit. It works wonders.
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post #4 of 37
So adding the backplate + lapping the cpu and heatsink had no effect on your temps? All that effort for nothing. I can feel your pain.
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post #5 of 37
How dare you not post pictures
post #6 of 37
How much Thermal compound did you use? If you have both surfaces lapped you really only need a dot. I mean, squeeze enough out of the tube so you can see it (about 1.5mm or so, then dab it on the center of the processor. Thats all you really need. The pressure from the heatsink will spread it out nicely. also, be sure once the cooler has been set to give it a little wiggle action. Rotate it clockwise/counter-clockwise a couple degrees to really settle it in. REALLY, it works wonders, you wont believe it. Also, most TIM takes time to cure, so the temperatures will drop over the next few days.

edit: just read how much you used... Try using less, like I described above.
Edited by 0rion - 2/20/09 at 12:59pm
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post #7 of 37
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Quote:
Originally Posted by GeforceGTS View Post
How dare you not post pictures
I know. Slap my hand. I was in a rush and didn't feel like going to find my camera. If I ever take it apart again I'll take some photos of my shiny copper goodness.
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post #8 of 37
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Quote:
Originally Posted by 0rion View Post
How much Thermal compound did you use? If you have both surfaces lapped you really only need a dot. I mean, squeeze enough out of the tube so you can see it (about 1.5mm or so, then dab it on the center of the processor. Thats all you really need. The pressure from the heatsink will spread it out nicely. also, be sure once the cooler has been set to give it a little wiggle action. Rotate it clockwise/counter-clockwise a couple degrees to really settle it in. REALLY, it works wonders, you wont believe it. Also, most TIM takes time to cure, so the temperatures will drop over the next few days.

edit: just read how much you used... Try using less, like I described above.
I could give it a go. I know about the benefits of very little TIM so maybe I will try what you suggested. My main concern is that the "dot spreading to outside edges" approach assumes two flat surfaces against one another which forces the TIM all the way out to the extremities (no place else to go). My concern was that the cracks between the heatpipes and the aluminum holder would allow the pressure to dissipate up into the cracks and prevent spreading to the outer edges. Hopefully, prefilling the cracks will prevent this.

There is one way to find out... Try it and then immediately remove the heatsink for observation.

May not get around to this for a little while. My wife is already suggesting I spend a little too much time on "those damn computers". I have a bunch of renovation work on the house that needs finishing... sigh...
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post #9 of 37
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Quote:
Originally Posted by Jras View Post
So adding the backplate + lapping the cpu and heatsink had no effect on your temps? All that effort for nothing. I can feel your pain.
Well I did get a sore right arm and roughened finger tips out of the deal so not a total loss
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post #10 of 37
I am a little surprised you saw no improvement as I saw an improvement after just doing the HDT Cooler. then a greater improvement after both were done.
To me it was well worth the exercise.
From your description I am not 100% sure what you mean with regards the TIM application, but the link HERE is how I do the application on HDT Coolers, and it worked better than all the other ways I tried.
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