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Applying thermal compound best & easiest way ?

post #1 of 5
3/6/09 at 5:23am
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I will be installing my hyper 212 tomorrow and have never applied any compound always used stock HSF. Iv'e been reading and so far its been suggested a horizontal line or a small blob in the middle of the cpu the size of a grain of rice? Are these the correct practices?

What is the best way? I don't want to have to remount would like to get it working the first time.
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post #2 of 5
3/6/09 at 5:28am
Quote:
Originally Posted by 1RonMan View Post
I will be installing my hyper 212 tomorrow and have never applied any compound always used stock HSF. Iv'e been reading and so far its been suggested a horizontal line or a small blob in the middle of the cpu the size of a grain of rice? Are these the correct practices?

What is the best way? I don't want to have to remount would like to get it working the first time.
I do it according to AS5 instructions:

http://www.arcticsilver.com/pdf/appi..._quad_wcap.pdf
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post #3 of 5
3/6/09 at 10:08am
it depends on which kind of compound you're using.. if using AS5 then do what he said ^^
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post #4 of 5
3/6/09 at 10:11am
A small dab for dual cores, a line for quads, or stenciling for anything.
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post #5 of 5
3/6/09 at 10:11am
Yep, it really depends on what type of TIM you are using. The stickier stuff I usually spread out a bit before mounting the HSF. The thinner stuff I do a glob in the middle of the CPU and let the pressure do the work.
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